Embedded Computing Design

Austin, Texas. Silicon Labs delivered the opening keynote for the inaugural embedded world North America. CEO Matt Johnson and CTO Daniel Cooley discussed how AI is innovating IoT, while also highlighting the company's upcoming Series 3 platform.

Santa Clara, California. RISC-V International revealed the ratification of the RVA23 Profile. RVA Profiles allow implementations of RISC-V 64-bit application processors that run OS stacks from standard binary OS distributions.

Munich, Germany. Codasip generously donated its newly developed Software Development Kit (SDK) for CHERI to the communal CHERI Alliance, and makes the SDK freely available for download on GitHub. CHERI (Capability Hardware Enhanced RISC Instructions) is an innovative security technology established by the University of Cambridge in collaboration with SRI International.

GÖPEL electronic announced its Multi Line product family, an innovative platform of inspection systems that supports the manufacturing process. The crux of the solution is a modular base system with a robust software interface to enable the reduction of training constraints, tedious employee scheduling, and the optimization of discourse between production staff.

During this year’s RISC-V Summit, CAST will be in booth S13 demonstrating its processors offered in ASICs or FPGAs for embedded systems, Internet of Things edge devices, industrial control systems, automotive, and aerospace applications. CAST’s RISC-V IP core line features processors focused on competitive 32-bit solutions in Functional Safety and Ultra-Low Power.

Rugged Science released its Nomad Series 3U 19" Rugged Rack Mount Server, designed for harsh atmospheres with flexibility for specific use cases. The Nomad 3U is ideal in mission-critical environments being built inside a 3U form factor and delivering next-generation processing power, extensive storage capacity, and advanced connectivity options.
 

Monrovia, California. Parasoft released news it has earned TÜV SÜD certification for the development of its C/C++test CT (continuous testing) product. Its C/C++test CT enables test automation following safety standards including ISO 26262 for automotive, DO-178B/C for aerospace, IEC 62304 for medical devices, EN 50128 for rail systems, and IEC 61508 for industrial automation and manufacturing applications.
 

Silicon Labs attended the inaugural embedded world North America exhibition and delivered an opening keynote from CEO Matt Johnson and CTO Daniel Cooley conferring how AI is driving innovation in IoT, while noting the expertise of the company's growing Series 2 platform and upcoming Series 3 platform.

Altera, an Intel Company, disclosed various FPGA hardware, software, and developmental tools that simplify accessibility across a broad range of use cases. During its annual developer’s conference, Altera discussed new information on its next-generation, power- and cost-optimized Agilex 3 FPGAs and revealed new development kits and software support for its Agilex 5 FPGAs.

Wirral, United Kingdom. LDRA has extended its support for the RISC-V instruction set architecture (ISA) with its competent analysis and verification tool suite built to support emerging RISC-V implementations such as Synopsys ARC-V processor IP. The suite provides enhanced tools for developers of RISC-V-based critical applications for aerospace and defense, mobile, industrial, IoT, artificial intelligence, and automotive.

Taipei, Taiwan. Neousys Technology introduced its compact and fanless POC-764VR, a computer developed for various surveillance applications in harsh environments, such as video analytics and object detection. It provides HD image capture, real-time detection, and thorough data analysis.


 

MosChip Technologies showcased its MosChip DigitalSky, a comprehensive suite of digital solutions innovating global enterprises into connected and intelligent entities, at embedded world North America. The suite offers IoT, Cloud, AI and GenAI, Application and Data Modernization, Security, Automation, and UX & Mobility support.

Wirepas mesh technology is designed for smart industry, smart city, and smart retail applications where communication challenges consists of noisy harsh environments. It overcomes the difficulties with a robust and self-healing mesh network. Stop by booth #1953 at embedded world North America if interested in industrial IoT, city planning, fire escape lighting, industrial sensors, or commercial building management technology.

Premio is attending embedded world North America and its experts will discuss what they have identified as critical challenges organizations encounter when deploying AI at the edge, and how its solutions meet those challenges. Highlights of Premio’s Booth #2133 will include the following trends: User Edge for Real-Time AI Inferencing, Localized AI for AGVs, AMRs, and Smart Manufacturing, AI-Driven Predictive Maintenance for Industrial Systems, Enhanced AI Capabilities through TPU Integration, and OT to IT Convergence for Industry 4.0 Computing.

ByteSnap Design announced a collaboration with Particle to innovate the development of efficient and scalable integrated IoT solutions utilizing ByteSnap Design’s proficiency in embedded systems development and Particle’s IoT infrastructure to provide optimized connectivity for automotive, healthcare, and smart cities.

NextComputing released its Nexus “Fly-Away Kit” that delivers multiple Ampere Altra servers for a total of 512 cores and a petabyte of storage. The kit has multiple system designs as well as a rolling operational hard case. Its multiple 2U or 1U systems (nodes) are fit into a 22" x 14" x 9" IATA and TSA approved rolling carry-on that suits overhead bins. Users receive Cloud Native, multi-node, and high bandwidth for robust edge AI and computing applications.

Secure-IC will be showcasing its innovative embedded cybersecurity solutions for applications such as IoT, Automotive, Factory Automation, or Server and Cloud at the inaugural embedded world North America 2024. Visit booth #1338 to view demonstrations how Secure-IC’s solutions can protect your devices and networks against vulnerabilities.

Taipei, Taiwan. Ubiqconn and its subsidiary, RuggON Technology Inc., will exhibit at embedded world North America 2024 (Booth #1733). Demonstrations will involve innovations in public safety, transportation, agriculture, mining, and industrial automation. Ubiqconn experts will discuss flexible embedded systems and SATCOM technologies.

Chatsworth, California and London, United Kingdom. Kigen and Monogoto launched the iSIM Evaluation Kit to test the efficiency of utilizing emerging iSIM technology in connected devices. iSIMs (integrated SIM) are integrated directly into modems eliminating friction caused by physical SIM cards. iSIMs eliminate the need for a physical SIM, simplifying the supply chain.

Austin, Texas. Mouser Electronics, Inc., is attending Embedded World North America 2024 where at Booth #2215, technical experts will hold lectures , panels, and opportunities for all to join in relevant discussions while demonstrating Mouser’s latest products, online tools, and technical information needed to accelerate your designs.