Embedded Computing Design

NEXCOM is attending embedded world North America where its booth (2505) will host the theme of "Unleashing the Ingenuity of Software-Defined Edge Computing" Demonstrations will include experts showing how developers can utilize software technologies of Edge AI IPCs and adapt hardware interfaces into software components. Experience the EdgeGPT SaaS in the academic and manufacturing use cases.

electronica will be held in Munich, Germany from November 12^th -15^th with 3,000 plus exhibitors from around the globe exhibiting the latest products and solutions. The show includes practice-oriented forums, conferences, and various special events. electronica will establish a universal platform for discourse innovating an “All Electric Society”, in which complete energy demand is covered by CO²-neutral electricity.

Visitors to embedded world North America should make at stop at American Portwell’s booth (1940) for a live exhibition of the WEBS-45J1 system running the Network Optix intelligent video management solution. The demonstration highlights the system’s abilities to manage complex video analytics and operational tasks for various surveillance and security scenarios.

Minneapolis, Minnesota. Digi International launched its future-proof Digi 360, a new subscription-based solution delivering ease-of-use, deployment visibility, and enhanced ROI for Digi cellular routers. Digi 360 includes flexible devices, software, and services enhanced to streamline development of IoT projects.

congatec will exhibit its extensive range of Computer-on-Modules (CoMs) at embedded world North America (Booth 2223) with innovations that include congatec’s novel aReady. strategy, new Intel Core Ultra processor-based modules with integrated AI, and further premieres based on new low-power high-performing x86 processor technology.

While visiting embedded world North America, make sure to stop by Star Lab's booth (1732) where it will discuss how simple it is to create a secure-by-default Yocto-based system with Star Lab's Kevlar Embedded Security. The Kevlar Embedded Security is a layered Linux security platform that helps deter IP theft and attain cyber resiliency for commercial embedded systems. 

Atsugi, Japan and Cambridge, United Kingdom. Sony Semiconductor Solutions Corporation (SSS) and Raspberry Pi Ltd revealed a collaboration developing the Raspberry Pi AI Camera leveraging SSS’s approx. 12.3 effective megapixel IMX500 intelligent vision sensor capable of on-chip AI image processing.

Taipei, Taiwan. Darveen Co., Ltd. revealed its 20 mm (0.79") thick RTC-I116 rugged tablet leveraging a 12th gen Intel Core i7/i5 processor and Intel Iris Xe graphics for high-performance processing of large amounts of data, images, and videos displaying on an 11.6-inch FHD (1920 x 1080) multi-touch screen with a brightness of up to 1,000 nits.

Join Edge Impulse at Embedded World North America to witness how it is transforming edge AI projects by empowering developers and ML engineers to build datasets (including with synthetic data), train models, and optimize libraries to run directly on device, from the smallest microcontrollers to gateways, with the latest neural accelerators (and everything in between).

During embedded world North America, AAEON will exhibit its portfolio of pioneering AI solutions designed to bring embedded AI projects to realization. The main highlight of the booth will be a demonstration combining AAEON’s EPIC-RPS9 and MXM-ACMA. Visitors will witness the utilization of the 13th Generation Intel Core processing power of the EPIC-RPS9 with the MXM-ACMA’s Intel Arc GPU.

F S Elektronik Systeme has released its compact (35 x 40 mm) PicoCore MX93 leveraging the NXP i.MX 93 ARM CPU compatible with the PicoCore series such as the i.MX 8M Mini, i.MX 8M Nano, and i.MX 8M Plus CPUs. Featured is a scalable core complex with up to two ARM Cortex-A55 operating at up to 1.7 GHz, alongside an ARM Cortex-M33 core for real-time processing at 250 MHz. For high-temperature environments, the CPU functions up to 125°C.

Molex introduced its VaporConnect Optical Feedthrough Modules for two-phase immersion cooling delivering continuous increases in data center speed and capacity. The modules leverage a cassette-based design that simply bolts on immersion tanks and facilitates optical transceivers and network cabling infrastructure to be switched without modifying mechanical interfaces or impacting immersion tank architecture for generative AI and machine learning workflows.

Samtec experts will be attending embedded world North America 2024 in Austin October 8-10, 2024, showcasing its solutions for a new era in connectivity. Stop by Samtec’s booth (#2632) to connect with professionals who are driving standards development and advancing cutting-edge solutions for superior signal and power integrity implementation. According to Samtec, it offers the industry’s largest selection of board-to-board connectors such as high-speed mezzanine, ultra micro, edge card, backplane systems, and high-density array systems.

Qoitech introduced a new API for its Otii Product Suite, altering the way designers work with battery emulation. The API automates battery emulation, making it faster, easier, and more efficient to optimize battery life for IoT devices.

 

During embedded world North America, visit Booth 2517, where Connect Tech, an NVIDIA Elite Partner, will be exhibiting its innovative solutions for intelligent video analytics utilizing NVIDIA Metropolis running on its field-deployable Anvil Embedded System, leveraging the NVIDIA Jetson AGX Orin system-on-module (SOM) as well as many other edge AI solutions.

RuggON, an Ubiqconn company specializing in rugged mobile solutions, is participating in MINExpo 2024 from September 24th to 26th in Las Vegas, Nevada. RuggON’s innovative rugged tablets and mobile computing solutions will be exhibited at booth 3043.

Quebec City, Canada. Dimonoff has announced the expansion of its new IoT division, Amotus. It delivers a complete range of engineering services, such as electronic design, software development, and Platform as a Service (PaaS) solutions. Dimonoff acquired Amotus in 2018 unified both entities in 2021 to combine the brand image and standardize its service offering under the Dimonoff brand.

Quebec City, Canada. LeddarTech is pleased to join Ficosa at Autosens Europe in Barcelona from October 8-10, 2024. LeddarTech and Ficosa initially began a planned collaboration to design an innovative Intelligent Parking Assistance system in 2022. The result, in 2023, was the integration of LeddarTech’s LeddarVision software with Ficosa’s surround-view camera system and sensors such as radars, IMUs, and GPS.

Taipei, Taiwan. ASRock Industrial released its IMB-X1900 motherboard leveraging Intel Xeon W-3500/3400 and W-2500/2400 series processors combining progressive innovation with boosted processing power and AI acceleration.

Sophia Antipolis. France. Insight SiP introduced its ISP2454-MX module in an 8 x 8 x 1mm form factor and an operating temperature up to 105°C enabling it to support next generation Bluetooth based solutions such as Angle of Arrival and the new Bluetooth Channel Sounding technology. Centered around the Nordic nRF54L15, it delivers enhanced functioning across the board and is based on a 4th generation radio and a double speed microprocessor.