congatec will exhibit its extensive range of Computer-on-Modules (CoMs) at embedded world North America (Booth 2223) with innovations that include congatec’s novel aReady. strategy, new Intel Core Ultra processor-based modules with integrated AI, and further premieres based on new low-power high-performing x86 processor technology.

Drones carrying out landscape and agricultural surveillance tasks need to capture massive image data sets for 3D modeling and analysis. The smart binary brains of those drones are more and more often built using off-the-shelf credit card sized Computer-on-Modules, seconded by off-the-shelf standard carrier boards.

With all the buzz around AI and virtualization, especially with the focus on Digital Twin in the embedded systems space, companies are getting loaded up with processing, memory, and applications tailored to deploying these sophisticated modeling and (eventually) predictive AI tools.

Embedded Computing Design’s Road to Embedded World will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at Embedded World, April 9th to 11th in Nuremberg, Germany. Embedded World is the largest global gathering of its kind. Check back regularly to see where the Road to Embedded World takes us.

San Diego, CA, congatec announced a new product family, aReady.COM, supporting the implementation of embedded and edge computing technology with the assistance of high-performance embedded building blocks, ranging from Computer-on-Modules (COM) to cloud.

Christian Eder, Chair of the COM-HPC working group and Director of Market Intelligence at congatec, shares the key innovations in the high-performance Computer-on-Module standard.

Deggendorf, Germany. congatec is including the firmware integrated Hypervisor in all new x86 COMs aimed at streamlining real-time virtualization for system consolidation. The solution makes it easier to save money and reduce individual systems while also reducing size, weight, and power (SWaP).