congatec released the x86 based COM-HPC Server modules by announcing availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D.

congatec welcomed the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.

The PICMG has defined a set of standardized side-band/out-of-band management commands for the recently published COM-HPC Server-on-Module standard. It is called the COM-HPC Platform Management Interface specification, or COM-HPC PMI for short.

At a compound annual growth rate (CAGR) of 27% each year, the worldwide edge device market is growing. The main cause of this growth is due to more applications completing progressively complex tasks, while increasing the technical demands of edge components.