congatec conga-HPC/sILH
June 17, 2022
Product
![](https://data.embeddedcomputing.com/uploads/resize/1256/756/external/data.embeddedcomputing.com/uploads/articles/primary_images/1655487949.jpg)
congatec’s new Intel Xeon D-2700 processor based Server-on-Modules in the data center level COM-HPC Server Size E performance class are tailored for deeply embedded real-time servers for rugged environments that will digitize the world.
Improvements include up to 20 cores, up to impressive 1TB GB RAM, double throughput per PCIe lane to Gen 4 speeds, as well as up to 100 GbE connectivity and TCC/TSN support. With up to 8 RAM sockets they also boast massively more memory bandwidth, which is essential for server workloads. Additionally these modules support TCC/TSN enabled real-time Ethernet. This is a combination that many OEMs have been eagerly waiting for.