PICMG launched a COM-HPC interface specification for the management of embedded systems platforms. The goal is to help edge server engineers manage systems remotely. For example, if a system is hung up, an IT administrator can hit reset with the same effect as if he had gone to a factory floor or other site. The specification targets edge computer designs based on COM-HPC Computer-on-Modules with a view to simplifying maintenance and improving quality of service.

Take a look at the new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, conga-TC570r,  the new COM Express Compact Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications. For more price sensitive applications, congatec also offers a cost optimized Intel® Celeron® processor based variant for the extended temperature range from 0°C to 60°C.

congatec introduced 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules are designed to target demanding IoT gateway and edge computing applications.

Empowered by embedded computing, artificial intelligence is accelerating the speed of demand for medical imaging and big data analytics to improve patient health forecasts and early detection of diseases. The digitization of healthcare has the potential to radically change patient care and to significantly reduce healthcare costs. congatec equips developers of intelligent medical devices and healthcare solutions with appropriate application-ready building blocks to enable them to quickly and efficiently turn their smart solutions into reality. 

It all begins by optimizing system configurations.

The hardware components that drive smart vision applications go through a lot of changes during their development lifecycle.