Embedded Computing Design

Ayar Labs is joining the NVIDIA NVLink Fusion ecosystem by making its solutions optically and electrically compatible with NVIDIA optical and SerDes technologies enabling hyperscalers and system designers to build optically connected AI infrastructure around NVIDIA’s NVLink Fusion platform and partner ecosystem.

XELA Robotics is planning to introduce a variety of innovative tactile sensor enhancements at Automate 2026 (Humanoid Robot Pavilion, Booth 1888) to deliver a unique human sense of touch. The booth will demonstrate the company’s hardware agnostic uSkin tactile sensor family that has been expanded with abilities that make a more precise and flexible robotic hand.

Axiomtek released its IMB540 ATX Motherboard leveraging the Intel Bartlett Lake-S processor series with P-cores that delivers up to 125W for demanding, multi-workload environments. The board is highlighted by two PCIe Gen 5 x16 slots, three PCIe x4 slots, two PCI slots, and one M.2 NVMe PCIe x4. It is ideal for industrial edge AI, machine vision, and automation applications.

At COMPUTEX 2026, TEAMGROUP INDUSTRIAL is demonstrating its portfolio of industrial storage security solutions under the theme “100% Secure Your Data, Your Technology!”.

San Francisco Circuits, Inc. has attained Final Cybersecurity Maturity Model Certification (CMMC) Level 2 status following a successful independent assessment by an accredited Certified Third-Party Assessment Organization (C3PAO).

Patriot Memory is attending COMPUTEX 2026 with its booth (R0106) theme being "Building the Infrastructure of Intelligence." The company will demonstrate its unified hardware ecosystem designed to power everything from client PCs to enterprise data centers. It plans to debut its flagship Viper Steel 5 Infinite DDR5 memory and multiple high-performance PCIe Gen5 SSDs built for AI workloads, along with advanced ACPI enterprise RDIMM and Patriot Signature Line ECC memory solutions.

During COMPUTEX 2026, taking place from June 2 to June 5, APLEX Technology Inc. will be at Hall-2 Booth Q0502 with a central theme of "AI IN ACTION: Full-scale Industry AI Implementation”. APLEX will highlight its innovations including Certified ATEx Explosion-Proof Series, High-Hygiene Stainless Steel Solutions, and Edge AI and HMI Architectures.

At COMPUTEX 2026, in Hall 1, Booth J1317a, Elitegroup Computer Systems (ECS) is exhibiting its newest motherboards and LIVA Mini PCs under the theme “Power AI Computing”. The solutions highlight how compact and scalable PC platforms support AI Agent workloads, Edge AI processing, smart healthcare applications, and embedded deployments.

BIWIN is attending COMPUTEX 2026 where it will showcase its innovative enterprise SSDs at Hall 2, Booth 4F, R0102. The company will showcase its SP50Y/51Y and SS821 solutions.

MSI IPC will attend COMPUTEX 2026 (June 2–5, Taipei Nangang Exhibition Center), where At Booth J0605a, Hall 1 (1F), it will introduce its latest innovations in Edge AI and how its products are transforming global industry.  

ASRock Industrial will be at Booth R0514 during COMPUTEX Taipei 2026. From June 2 to June 5 the company will discuss how “Edge AI, Secure and Open” is defining the next generation of intelligent industrial computing. Live demonstrations will highlight the progression of Edge AI across agentic AI, physical AI, cybersecurity, and open automation. Presented will be ASRock Industrial portfolio of its industrial Edge AIoT platforms, embedded computer systems, and industrial motherboards.

In 1943, at the University of Chicago, Warren McCulloch and Walter Pitts published A Logical Calculus of the Ideas Imminent in Nervous Activity, leading to the foundational work on neural network concepts and modern-day artificial intelligence (AI). Now that AI is moving more to the edge, computer vision is becoming a critical tool. Computer vision systems use machine learning and deep learning to visualize and analyze data for defect detection and predictive maintenance in smart manufacturing

During COMPUTEX 2026, Aetina Corporation will demonstrate its latest innovations in edge AI solutions in Hall 1, Booth K0106. The booth will highlight Aetina’s portfolio including SuperEdge, MegaEdge, DeviceEdge and CoreEdge along with real-time interactive demonstrations co-developed with strategic partners and ecosystem innovators. The exhibition will show how edge AI is progressing from single inference models into integrated applications with contextual intelligence across Physical AI, Vision AI, and Agentic AI.

At the Global Space Technology Forum in Singapore, Enclustra demonstrated how reconfigurable hardware is shaping the future of space communication. At the show, Enclustra collaborated with Array Labs, Transcelestial, and Makarena Labs to demonstrate how advances in space technology will occur from the merging of reconfigurable hardware, artificial intelligence, and domain expertise.

NEXCOM will be a prominent force at COMPUTEX 2026 where it will be partnering with Intel in TWTC Hall 1, Booth A0618 at the "Robotics & Edge AI Pavilion". The booth theme will be "Physical AI and Manufacturing On-Site," where NEXCOM will show how Physical AI is accomplished by integrating visual perception and high-precision real-time motion control.

Visitors to COMPUTEX 2026 (Taipei Nangang Exhibition Center) will want to visit Booth R1014, Hall 2, 4F where Seasonic is set to introduce its new flagship power platform for AI, PRIME ENTERPRISE. Attendees will also witness Seasonic’s innovative ultra-efficient power development inspired by emerging 80 PLUS Ruby standards and the latest evolution of OptiGuard intelligent protection technology.  

Kardome’s Spatial Hearing AI for human-like voice localization and isolation is now being integrated into LG’s OLED TVs. The technology allows the TVs to locate and focus on individual speech with human-like accuracy, even when background noise is high.

Arteris, Inc.’s system IP technology is now being deployed by Li Auto Inc. The technology supports the underlying AI compute data movement and integration automation for Li Auto’s current and future smart vehicles, starting with its proprietary SoCs used in the all-new L9 Livis high-tech SUV.

Sundance DSP introduced the FG650-Polarfire, a variant of the company’s proven FG650 Four‑Channel Camera Link Frame Grabber that is executed on the Microchip PolarFire FPGA family. It is fully compatible with Sundance DSP’s Polarfire SOMs and carrier boards, allowing designers the ability to integrate high‑bandwidth imaging pipelines directly into heterogeneous compute systems combining FPGA acceleration, embedded processors, and edge‑AI capabilities.

Avalue Technology released its HPS-GNRU1A 1U rackmount server platform and the HPM-GNRUP industrial server board, merging the Intel Xeon 6 platform, PCIe Gen5 architecture, and high-density NVMe storage to offer customizable solutions for centralized data centers. The solution delivers up to 350W TDP and integrates PCIe Gen5 architecture with dual 10GbE LAN interfaces to meet the demands of high-speed data transfer and low-latency computing demands.