Embedded Computing Design

Austin, Texas. Ambiq is increasing its support for the Zephyr Project Real-Time Operating System (RTOS). The open-source Zephyr is now offered on the Apollo3 Family SoCs, Apollo4 Plus, Apollo4 Blue Plus, and the forthcoming Apollo510 MCU, for high-performing AI at the edge.

 

Milexia will attend electronica 2024 to share the fruition of several substantial acquisitions involving Whistler Technology and Cabcongroup. Booth (B2, 419) visitors will learn about the various supply chain solutions including power systems, connectivity, sensors, and sourcing services. Milexia will highlight eight distinctive technology areas to support a wide range of applications.

Munich, Germany. DigiKey will be attending electronica during November 12-15, 2024, in Munich, Germany. At its booth, #B4.578, DigiKey will showcase top designs from leading suppliers, select technical capabilities, tools, and prize give aways. “We always look forward to attending electronica and connecting with engineers, designers, students and colleagues from around the world,” said Dave Doherty, president at DigiKey.

Willich/Munich, Germany. ROHM Semiconductor Europe will be exhibiting its innovative power and analog technologies developed to increase power density, efficiency, and reliability in automotive and industrial applications. ROHM will be located at booth C3-520 under its motto "Empowering Growth, Inspiring Innovation." According to the company, it will showcase various demo application stations highlighting its semiconductor technologies and how they contribute to solving critical social and ecological challenges.

During electronica 2024, Keysight Technologies will exhibit (Hall A3, stand 506) various innovations in electronic design and test including its new HD3 oscilloscope and the PNA-X vector network analyzer as well as RF, digital, power testing, and the latest in PathWave Design electronic design automation (EDA) software.

Altium will announce its revolutionary product offerings at electronica 2024 with the highlight being its Altium Discover, a design developed to solve significant industry challenges by nurturing a trust-based collective environment that brings semiconductor manufacturers, distributors, and product developers together on a united platform. It utilizes the cloud capabilities of Altium 365 to run real-time and transparent collaborations, safeguarding stakeholders as they work together with certainty, from initial stages to deployment.

Cambridge, England. XJTAG will attend electronica, where at booth A3-260 it will highlight its latest version 4.0 of the XJTAG software suite and offer a first glance at the new XJLink-PF40 JTAG controller.

Sundance introduced its SMT-FMC116, a High-Pin-Count (HPC) FMC module delivering up to sixteen channels with a max of 125MSPS conversation rate and a 12-bit or 14-bit high-resolution. It features up to four of Analog Devices’ LTC217x quad-channel ADC converters semiconductors with LVDS interfaces and a single 1.8V power supply. The SMT-FMC116 will interface with Altera, AMD, Lattice and Microchip’s family of FPGAs without implementing a specific device-dependent IP-Core.

 

Intelligent Memory will attend electronica 2024 (Hall B4.101) where it will showcase its innovative JEDEC compliant DDR4 devices in x4, x8, and x16 DDR4 DRAM. The excitement is built around its new DDR4s that deliver 16Gb with clock speeds up to 1600MHz and data bandwidth up to 3200Mbps.

Smith will exhibit at electronica Munich 2024 from Tuesday, November 12, to Friday, November 15. It will be present in Hall B5 at Booth 331 to showcase its supply chain solutions. “Smith has been in the business of providing tailored solutions to the industry’s most complex supply chain challenges for more than 40 years,” said Mark Bollinger, Smith’s Chief Globalization Officer. “Our team of experts is excited to return to electronica Munich and share the many advancements we’ve made over the last two years with our global partners.”
 

Lanner’s new EAI-I731 is an innovative Edge AI platform designed to support low-latency AI inference in extreme industrial environments. The design leverages Intel power and meets the challenges of real-time computer vision applications, such as visual quality inspection, intelligent traffic management, and multi-stream video analytics for physical security. Operating temperatures range from -25ºC to 65ºC,
 

Axiomtek introduced its CEM710, a server-class COM Express Type 7 basic module leveraging the Intel Xeon D-1700 processor (Ice Lake D) with up to 10 cores, incorporated AI acceleration, and support for hard real-time workloads.

AAEON introduced the OMNI-ADP series, its Modular HMI Panel PCs including seven display sizes ranging from 10.4” to 21.5”. The family is powered by 12th Generation Intel Core processors. Across the series is an option of either PCAP and 5-wire resistive touchscreens, IP65 aluminum front bezel design, and both panel and VESA mounting options. Depending on the model, the OMNI-ADP PCs supports resolutions from 1024 x 768 - 1920 x 1080.

MosChip is now an AI/ML Design Partner in the Renesas RZ Partner Ecosystem, leveraging its proficiency in AI and ML to work together with Renesas and its global network of collaborators. MosChip has developed Smart Safety with PPE Kit Detection, Patient Monitoring System, ADAS Brake Alert with Distance Monitoring, and Action Recognition with Pose Estimation based on Renesas RZ/V series MPUs with DRP-AI accelerators.

IC’Alps released information that Tiempo Secure has earned Common Criteria certification from ANSSI French state agency as a significant stage of its three yearlong partnership implementing Secure Element IP together.

Sealevel Systems announced its Flexio Fanless Industrial Embedded Computers leveraging a Quad-core Intel Atom or Core processor. The computers were developed to deliver power, connectivity, and performance that make them an ideal controller for automation, point-of-sale, test and measurement, medical, and security applications.

GÖPEL electronics’ SYSTEM CASCON software platform featuring Test Coverage Analyzer (TCA) has been an effective tool delivering comprehensive data regarding test coverage and potential test gaps including information on which nets and pins have been tested adequately and which have not. During electronica 2024, GÖPEL electronic will introduce an innovative development with smartTCA. According to the company, it is the world's first artificial intelligence (AI) supported test coverage analysis tool for use with embedded instruments.
 

Taipei, Taiwan. Advantech introduced the IPC-610-P, a 4U rackmount chassis that delivers 850W and 1200W ATX 3.1 power supplies, making it well-suited for the NVIDIA RTX 6000 Ada Generation GPUs. It was engineered to accelerate the implementation of smart AI IoT technology. Optimized for machine vision and automated optical inspection (AOI), the IPC-610-P is ideal for the semiconductor industry for its high-efficiency computing and enhanced performance and stability.

TDK Corporation will showcase its solution portfolio at electronica 2024 in Munich, Germany from November 12 to 15, 2024. Visitors to Booth B5.179 will experience the recently determined long-term vision “TDK Transformation. Accelerating transformation for a sustainable future”.

Kirkland Washington. Alliance Memory announced the expansion of its high-speed CMOS mobile low-power SDRAMs with a new single-channel 16Gb LPDDR4X device. It merges higher power efficiency with enhanced clock speeds and data rates in a 200-ball FBGA form factor.