Sealevel Systems produces some of the most rugged embedded computers that you may ever come across. And for many applications, they are a perfect fit. But if your application requirements are slightly lower, like you don’t need to deal with the highest levels of shock and vibration or the most extreme temperatures, Sealevel now has an offering for you. And it comes at a price point that’s likely easier on your budget. Hear more about the company’s new line in this video with Doug Trent, Sealevel Systems’ Inside Sales Manager.

Mission-critical industrial applications are often challenged with providing flexibility, reliability, connectivity, high-performance computing, and much more to environments that can sometimes be unpredictable and dangerous. 

Sealevel Systems announced its Flexio Fanless Industrial Embedded Computers leveraging a Quad-core Intel Atom or Core processor. The computers were developed to deliver power, connectivity, and performance that make them an ideal controller for automation, point-of-sale, test and measurement, medical, and security applications.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the Computer Boards, Systems, Components, & Peripherals category:

During April 9-11, Sealevel Systems, Inc. will have an exhibition at embedded world 2024 (Hall 3, Stand 141) with a motto “Connecting the Embedded Community” focusing on the future of hardware design, M2M communication, vision, and edge technology.

COM Express has been around for at least a decade. While many people think of it as a standard architecture (it is), it can be customized in lots of different ways. To understand how a standard can be made custom while remaining standard, I spoke to Earle Foster, a Senior Vice President, Sealevel Systems in this week’s Embedded Executives podcast. It’s actually easier than you might think.

Designed to meet a wide variety of application needs, the 12009 evaluation board supplies a diverse I/O mix and robust processing support. Standard I/O includes Gigabit Ethernet, USB 3.0, USB 2.0, GPIO, RS-232, and Mini DisplayPort. The carrier board is designed for the congatec® conga-TC370 COM Express family, with support for 8th generation Intel® Core™ processors, up to 64 GB DDR4 RAM, and TPM 2.0 support. The 12009 features a wide operating temperature range of 0ºC to 70ºC and is powered via a locking, four-position Molex Micro-Fit connector.