AAEON, a Titanium member of the Intel IoT Solutions Alliance, will be in Hall 1, Booth 306 at embedded world highlighting its edge AI hardware platforms. Its collaboration with Intel aims to bring innovative products to market and implement edge AI solutions through bilateral initiatives, shared practices, and joint goals.

Taipei, Taiwan. AAEON released its BOXER-8654AI-KIT, a development kit integrated with either an 8GB or 16GB NVIDIA Jetson Orin NX module. The kits’s module comes with an innovative carrier board highlighted with a full-function I/O including six USB 3.2 Gen 2 ports, an Out-of-Band (OOB) management box header, and four LAN ports with possible power boards for PoE capability.

Developed on the Intel Arc A750E GPU architecture, AAEON's GAR-A750E delivers 28 Xe-Cores and supports various advanced AI development frameworks built in a 236mm x 109mm x 42mm form factor. The GAR-A750E features extensive raw computing power, with a graphics turbo frequency of 2400MHz combined with the AI task acceleration capabilities of the 448 Intel XMX Engines.

AAEON introduced its NanoCOM-ADN, a COM Express Mini Size Type 10 module leveraging the Intel Atom x7000E and Intel Processor N-series CPUs, including the quad-core Intel Atom x7425E (12W) and 8 core Intel Core i3-N305 (15W).

AAEON introduced its uCOM-IMX8P, an adaptable SMARC 2.1 compliant CPU module built on the NXP i.MX 8M Plus platform with an 82mm x 50mm SMARC form factor to utilize RISC architecture. The solution leverages the NXP i.MX 8M Plus’ Quad-Core Arm Cortex-A53 processor with an integrated NPU, an operating temperature range from -40°C ~ 85°C, and 4GB of onboard LPDDR4 memory and up to 128GB eMMC storage (default SKU: 16GB).

AAEON released the MXM-ACMA-PUC leveraging a range of 13th Generation Intel Core CPUs up to 35W, with the default processor being the 16 core, 24 thread Intel Core i7-13700TE. It includes an integrated MXM-ACMA module, offering either an embedded Intel Arc A370E or Intel Arc A350E GPU. The MXM-ACMA-PUC supports four LAN ports, (three running at 2.5GbE, and one at 1GbE), two USB 3.2 Gen 2, and two COM ports with RS-232/422/485 functionality.

AAEON's UP brand released the UP 710S, the next generation credit card sized single-board with adjusted height measuring at just 25.13mm. The solution’s size, when compared to previous models, does not reduce I/O options. The UP 710S upholds key features like GPIO, I2C, SPI, and COM that were possible via a 40-pin HAT through dedicated wafers.