Embedded Computing Design

AAEON’s UP brand released its UP Squared Pro 710H Edge, a Mini PC equipped with an onboard Hailo-8 edge AI processor leveraging a choice of either Intel Core i3-N305 or Intel Processor N97 embedded CPUs.

Chicago, Illinois. Littelfuse, Inc. introduced its LS0502SCD33S, the newest member of the eFuse Protection IC lineup. The design introduces the Single Cell Super Capacitor Protection IC, developed specifically for charging backup power sources under harsh environments. The LS0502SCD33S leverages supercapacitor technology delivering a broad temperature range and offers superior power/energy density. It efficiently manages high operational voltages (above 3 V).

Kirkland, Washington. Alliance Memory released its expanded series of high-speed CMOS mobile low-power SDRAMs consisting of 16Gb and 32Gb LPDDR4X devices. Low-voltage operation of 0.6V, the 16Gb AS4C512M32MD4V-046BIN and 32Gb AS4C1G32MD4V-046BIN deliver enhanced efficacy in battery life.  

Taipei, Taiwan. TAITRA (Taiwan External Trade Development Council) announced that Charles Liang, President and CEO of Supermicro, will deliver a COMPUTEX keynote on June 5, 2024 at Taipei Nangang Exhibition Center Hall 2 7F.  He will explain Supermicro's cutting-edge systems designed and optimized for a wide range of compute workloads, as well as new AI technology.

Hsinchu, Taiwan. Nuvoton released its NuMicro MA35D0 series, an enhanced microprocessor targeting industrial edge device applications delivering extensive connectivity and security. The platform is powered by dual power-efficient high-performance 64/32-bit Arm Cortex-A35 cores (Armv8-A architecture), running at up to 650 MHz, with 32KB of L1 instruction and data cache for each core, plus a 512KB shared L2 cache.

Pompano Beach, Florida. “We are deeply honored to be awarded this prestigious recognition by Embedded Computing Design, at the 2024 NVIDIA GTC AI Conference,” said Ken Jackson, President of Concurrent Real-Time.

Powerbox (PRBX) released its ECD1000A family for harsh environments including ground-based defense applications and industrial. The platform is contained in a metal IP65 enclosure with baseplate conduction cooling delivering 1000W that is compatible with a baseplate operating temperature range of -40 up to +75 degrees C. Able to meet the requirements of the MIL-STD-810H standard, interior boards and components are protected with a conformal coating.

Axiomtek introduced its ICO520, an IIoT edge gateway designed to aid in the development of sustainable energy, oil and gas, factory automation, intelligent agriculture, and smart building. Leveraging the 12th Gen Intel Core i7/i5/i3 or Celeron processors, the ICO520 adapts and scales determined by variations in the OT environment. The DIN-rail fanless edge gateway delivers an adaptable design with a variety I/O interface, wireless module expansion, and dual display support.

Minneapolis, Minnesota. Digi International introduced its Digi Connect Sensor XRT-M, the newest member to its remote monitoring and control family. Leveraging Digi Axess, Digi Connect Sensor XRT-M offers users edge and cloud-based control options utilizing a management platform with an intuitive interface streamlining data management with an array of I/O.

Malvern, Pennsylvania. Vishay Intertechnology, Inc. recently released an Automotive Grade IHDF edge-wound through-hole inductor with rated current up to 72 A and saturation currents up to 230 A. Leveraging ferrite core technology and a low 15.4 mm form, the Vishay Custom Magnetics IHDF-1300AE-1A operates seamlessly across a wide temperature spectrum from -55 °C to +155 °C, ensuring low AC and DC power losses and effective heat dissipation.

Cheryl Martin, director of Higher Education and Research at NVIDIA says, “Georgia Tech’s AI Makerspace will provide students with access to NVIDIA’s accelerated computing platform, equipping them with the technology to push the boundaries of AI learning and research.”

Taiwan. At COMPUTEX 2024, QSAN will demonstrate its innovative solutions to advance enterprise in the future of AI. First, the XCubeFAS 5226 delivers unparalleled performance. It supports low latency, high throughput, and various IOPs to accelerate challenging workloads for AI applications.

“If a vehicle crashes while it is recording video on a dashboard camera, a resulting power loss can cause the loss of the last 30 seconds or more of the recording,” said Teemu Sivonen, Product Manager at Tuxera. Tuxera released an innovative data resilience and fail-safety feature for embedded systems developers, its hardware cost-friendly Tuxera Persistence Manager.

Chicago, Illinois -- Newark recently conducted an element14 Community poll to measure the current opinion on Industry 5.0 that states that robots and other machines will begin to work alongside humans by utilizing IoT and big data. Results showed various insights on industry experts believing Industry 5.0, while a valid thought, is just premature talk.
 

Tualatin, Oregon. The newest member of VersaLogic’s line of rugged computers, its Swift, featuring Intel’s Coffee Lake Refresh 9th-generation Xeon processor (6 cores and Hyper-Threading) with up to 32GB of error-correcting memory, enhanced 128 GB NVMe SSD storage, and TPM 2.0 security. Functional error-correcting memory is ideal for mission-critical applications and aeronautics applications at higher altitudes. The platform was engineered and tested for defense, aerospace, and medical applications.

AAEON introduced its RTC-1010RK, the latest innovation to its 10.1" rugged mobile tablet with integrated Rockchip RK3399 processor. The platform leverages a quad-core Arm Cortex-A53 and a dual-core Arm Cortex-A72. The RTC-1010RK is designed for challenging deployment environments such as field inspection, warehouse management, and factory automation.

Micron Technology, Inc. revealed it is sampling the automotive-grade Micron 4150AT SSD, the first quad-port SSD capable of interfacing with up to four systems on chips (SoCs) to centralize storage for software-defined intelligent vehicles. It delivers single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface, and ruggedized automotive design supporting the environment with data center-level flexibility and power.

EKF* introduced the 7L600, its first ModBlox7-based product at Embedded World. The 7L600 is a single-pair Ethernet (SPE) switch combining modularity with superior computing power and innovative interfaces. The switch is designed as a multifunctional gateway in a wide range of IIoT or retrofit applications and able to act as an edge computer for (real-time) data pre-processing and data collection leveraging an on-board ARM CPU.

DEEPX plans to develop its first-generation AI chip portfolio to concentrate intelligent video analytics and security system market. DEEPX plans an exhibition at COMPUTEX 2024 where it will demonstrate the acceleration of its on-device AI solutions.

Arm will host a special event during COMPUTEX 2024*. Arm CEO Rene Haas will speak at 11:30 a.m. on June 3rd at the Grand Halai Hotel in Nangang. He was designated CEO in February 2022. Before CEO status, Rene was President of Arm's IP Product Groups (IPG). Rene made over IPG to emphasize ideal solutions for vertical markets with a robust product portfolio.