High-speed interconnect industry-standard interfaces for communications between processors, accelerators, memory, storage, and other IO devices.

In this episode of Embedded Insiders, Bruce Franklin, Senior Director of Automotive at Micron, joins us to share his 2025 predictions for the automotive industry. He dives into the role of embedded memory and storage in robotaxis, key considerations for manufacturers, and how these advancements will shape the future of self-driving cars and next-generation architectures.

Memory for automotive applications needs to be different from memory that’s intended for other applications. Why is that? I could not answer that question, so I turned to Michael Basca, the Vice President of Embedded Products and Systems within Micron’s Embedded Business Unit. As you might expect, Michael had no trouble answering the question. Hear what he had to say on this week’s Embedded Executives podcast.

In this era of AI, designers have to think differently about every aspect of their projects. That includes the memory subsystem. To that end, Micron had a series of announcements to help facilitate AI, particularly on mobile devices (most compact UFS package, collaboration with Samsung, and Magic6 Pro smartphone). But beyond each subsystem, there’s just so much that needs to be learned and still so much that’s unknown. That’s where this week’s Embedded Executives podcast takes us. On this episode, I spoke to Mark Montierth, a Corporate VP and the General Manager of Micron’s Mobile Business Unit.

Micron Technology, Inc. revealed it is sampling the automotive-grade Micron 4150AT SSD, the first quad-port SSD capable of interfacing with up to four systems on chips (SoCs) to centralize storage for software-defined intelligent vehicles. It delivers single-root input/output virtualization (SR-IOV), a PCIe Generation 4 interface, and ruggedized automotive design supporting the environment with data center-level flexibility and power.

It really is possible to make memory that’s geared toward a particular application, if you’re still of the belief that AI is an application. I learned that fact recently, thanks to the folks at Micron Technology, who recently announced that they are delivering qualification samples of the company’s Universal Flash Storage (UFS) 4.0 mobile solution.

As electronic devices are continuously shrinking in order to keep up with the demands and advancements of next-generation technologies, semiconductor companies must consistently keep up with those requirements. Storage and memory technologies such as DRAM are embedded in almost every electronic device active on the market today, and they are no exception to the laws of physics in the semiconductor space.