IAR Systems Boosts Development of Embedded Applications Based on NXP’s i.MX RT1160 Crossover MCUs

IAR Systems

May 20, 2021

Sierra Wireless Extends 5G Mobile Broadband with Next Generation 5G Modules

Tiera Oliver

May 19, 2021

SEMIFIVE Collaborates with Arm to Accelerate its Custom SoC Designs

Tiera Oliver

May 19, 2021

Industrial COM Express Type 10 Mini Module with Intel Atom E3900 Processor

WinSystems, Inc.

May 19, 2021

u-blox NINA-B4 Bluetooth 5.1 Module Enables Mesh Networking for IoT Applications

Tiera Oliver

May 18, 2021

Sondrel Reference IP Enables HPC SoCs While Reducing Cost and Design Time by 30 Percent

Brandon Lewis

May 18, 2021

Sondrel has added the SFA 300 reference design to its semi-custom SoC IP portfolio. Consisting of four-CPU clusters featuring 4 TOPS per channel of AI processing and 400 GOPS per channel of DSP performance, clusters can be daisy chained via the PCIe interface to create HPC solutions. The IP reuse solution enables the creation of differentiated AI, 8K video, blockchain, data analytics, and other high-performance data processing solutions by integrating customer-specific IP such that design time and cost can be reduced by up to 30 percent.

SmartDV Automation Tool Suite Accelerates Protocol Debug, Testbench Creation

Brandon Lewis

May 17, 2021

SmartDV has packaged the SmartViP Debug, a tool designed for automated protocol debugging, and SmartTestBench, which automatically generates testbench files and includes a variety of verification scenarios, into a unified automation tool suite. By identifying protocol violations and presenting them in graphical views or through tabular or text-based representations, the combined offering helps eliminate manual verification processes.

Sigasi Studio Offers Free Coding & Syntax Tools for Digital Designers

Brandon Lewis

May 15, 2021

Dante Embedded Platform SDK for SHARC Audio DSPs Benefits AV-over-IP Developers

Brandon Lewis

May 14, 2021

Why the Properties of Graphene at Cryogenic Temperatures are Making Quantum Computing Increasingly Viable

Ellie Galanis

May 12, 2021

ADLINK Releases Industry-First Embedded MXM Graphics Modules on NVIDIA Turing Architecture

Tiera Oliver

May 11, 2021

Armv9 Debug & Trace Support Added to Lauterbach TRACE32 Tool Suite

Brandon Lewis

May 10, 2021

Applied Materials Introduces New Materials to Advance DRAM Technology

Rich Nass

May 10, 2021

Set Up Headless Raspberry Pi Using MacOS

Jeremy S. Cook

May 7, 2021

Virtium Introduces Small Form-Factor DDR4 Memory Modules

Rich Nass

May 6, 2021

IAR Systems Enables Scalable Automotive Development Based on Infineon Traveo II Including MCAL

Tiera Oliver

May 5, 2021

Product of the Week: Texas Instruments' Sitara AM6442 Real-Time Networked Processor

Embedded Computing Design Staff

May 4, 2021

Avnet Launches XRF8 System-on-Module for Multi-Channel RF Applications

Tiera Oliver

May 4, 2021

Chenbro Announces Chassis Reference Motherboard Program for Intel Ice Lake Processor Platform with Ma Labs

Chenbro

Ma Labs

May 4, 2021

Taipei, Taiwan — Chenbro (TWSE: 8210) announced its reference motherboard program, launching in collaboration with Ma Labs (USA), which will provide pre-tested 3 rd Generation Intel Xeon Scalable (codename ‘Ice Lake’) server barebone solutions for the North American market.

Logic Design Solutions Introduces the First NVMe HOST IP on POLARFIRE SoC FPGA

Tiera Oliver

May 4, 2021

VadaTech Announces a QorIQ P5040 Processor AMC with PCIe Interface

Tiera Oliver

May 3, 2021

The GENE-CML5 3.5" Subcompact Board From AAEON Offers Functionality to Support Industrial and AI Applications

Tiera Oliver

April 27, 2021

IoT Security and the Protection of IP at the Edge

Jake Schaffner

April 26, 2021

u-blox ALEX-R5 LTE-M module with IoT Security-as-a-Service receives 2021 IoT Evolution Industrial IoT Product of the Year Award

u-blox

April 26, 2021