Technology - Processing
Processing
Evolving Chip Design: Challenges & Innovations with Atomera & Siemens EDA
April 3, 2025
In this episode of Embedded Insiders, Scott Bibaud, President and CEO of Atomera, explores the rising costs of semiconductor manufacturing and the challenges of scaling to advanced nodes like 3nm and 2nm. He breaks down the diminishing performance gains and the complexity of high-volume semiconductor architectures.
Next, Rich and Scot Morrison, Vice President of Shift Left Software Product Management at Siemens EDA, discuss the growing specialization of chip design—and why development tools must evolve to keep up.
But first, Rich and I examine Moore’s Law and whether the push for ever-smaller chips is truly the best path forward.
Processing
Embedded Executive: Chip Design Is Not Getting Easier | Siemens
April 2, 2025
Chip design has always been a complex process, and there is no end in sight. What has improved are the tools available to an IC designer. The chips are getting more specialized; hence, the tools must drill down further into the process than ever before.
This sounds like a lot of black magic, but it becomes less cloudy when someone who understands the process walks you through it. To get more clarity for myself, I invited Scot Morrison, the Vice President of Shift Left Software Product Management at Siemens EDA, to be my guest on this week’s Embedded Executives podcast. Scott first lays out the problems, then walks through some of the various solutions.
Processing
Tria Unlocks AI and IoT Potential with Qualcomm-Powered SMARC Modules
March 28, 2025
As edge computing continues to transform with AI in the forefront, having a powerful and energy-efficient module is essential for next-generation applications. Tria's MSC SM2S-QCS6490 SMARC 2.1.1 and MSC SM2S-QCS5430 SMARC 2.1.1 modules are built with Qualcomm technology, delivering high-performance processing, AI acceleration, and extensive connectivity options. Whether for IoT, AI-driven automation, or real-time data processing, these modules are designed to handle the most demanding workloads efficiently.
Analog & Power
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Samtec Halo Optical Transceivers to Pave Way for High Performance
March 26, 2025
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Flex Power Modules Unveiled Advanced AI-Optimized Power Solutions at embedded world 2025
March 17, 2025
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embedded world Product Showcase: AMD’s Spartan UltraScale+ FPGA
March 11, 2025
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Selecting Current Sense Transformers for Switched-mode Power Supplies
March 10, 2025
Debug & Test
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Ignion's Oxion 2.0 Enhances RF Design with Real-Time AI Feedback and Expert Guidance
March 19, 2025
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The Road to embedded world: Linaro’s ONELab Enhances Cloud-Native Edge Readiness
February 19, 2025
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Experience UDE 2025 for the First Time at embedded world 2025: Seamless Debugging and Trace Capabilities
February 12, 2025
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The Road to embedded world: 4tlas to Present its Fuze Collection
February 10, 2025
IoT
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onsemi’s Hyperlux ID: 3D Vision for Robotics, Manufacturing, and Security
April 01, 2025
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Syslogic Expands RML A4AGX Capabilities
March 31, 2025
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STMicroelectronics Unveils STM32U3 MCUs with Power-Saving Innovations for Smart IoT
March 25, 2025
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embedded world 2025: APLEX Highlighted AI-Driven Edge Computing and Industrial HMIs
March 17, 2025
Open Source
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Embedded Computing Design Unveils Dev Kit Zone at embedded world 2025
March 06, 2025
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Z-Wave Alliance Launches 2024B Specification
February 17, 2025
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ESA Backs Frontgrade Gaisler in Pioneering Ultra-Deep Sub-Micron Space Chip Development
February 07, 2025
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What is the Matter Protocol? And Why Does It… Matter?
February 04, 2025