Ampere® Altra® Servers Now Available from Phoenics Electronics

Ampere Computing

June 25, 2021

Compact Half-Size IPC with XEON® Computing Power

ICP Germany

June 25, 2021

Digi Introduces the Digi ConnectCore 8M Mini

Chad Cox

June 25, 2021

SkyLab B.V. To Utilize Semtech’s LoRa Edge for Prototyping Board

Chad Cox

June 23, 2021

SiFive Performance P550 Core Sets New Standard as Highest Performance RISC-V Processor IP

Tiera Oliver

June 22, 2021

AIROC Wi-Fi & Bluetooth Combo Chip Offer Connectivity for TomTom's Satellite Navigation

Tiera Oliver

June 22, 2021

Product of the Week: Cadence Spectre FX FastSPICE Simulator

Embedded Computing Design Staff

June 22, 2021

SmartDV Joins the Xilinx Partner Program

SmartDV

June 21, 2021

Xilinx-Compliant Design IP Accessible to Xilinx Customers through Partner Program

Power Management and Power Efficiency Can Differentiate Your Product

Digi International

June 18, 2021

Power efficiency and power management are both key specs when it comes to embedded systems, particularly for industrial applications. However, they are quite different from each other and must be handled differently. Managing your power comes through fine tuning all your components, both hardware and software, and operating all devices only when required and at the intensity levels required. By contrast, power efficiency is the art of being able to maximum your processes with less power.

IBM's 2 nm Transistor Breakthrough Puts Chip Design Under the Microscope

Anupurba Mukherjee

June 18, 2021

PGY-LA-EMBD All-in-One Oscilloscope, Logic, and Protocol Analyzer for Embedded Interfaces

Saumitra Jagdale

June 18, 2021

The Latest Intel Core Processors Drive SLAM in Next-Gen AMRs

Vecow Co., Ltd

June 17, 2021

Industry 5.0 brings collaborative robots, or cobots into the industrial workplace. Unlike traditional robots, cobots can work and move safely alongside humans, free of cages, wires, or safe zones.

HMS Networks Launches a New IR-Based Intesis Interface

Tiera Oliver

June 16, 2021

Audio Interface Market: Increasing Demand for Efficient Management Practices Report Till 2023

Market Research Future

June 15, 2021

MicroSys Electronics Introduces System-on-Module with NXP S32G274A Processor

Tiera Oliver

June 15, 2021

Electronic Parts Shortage: Why the Automotive Industry Took the Worst Hit

Dan Dooley

June 15, 2021

Product of the Week: Digi International ConnectCore 8 SoMs

Embedded Computing Design Staff

June 14, 2021

SolidRun Introduces the First OCTEON TX2 CN9130 Mini SoM Capable of 10GbE Networking Speeds

Tiera Oliver

June 11, 2021

Mythic Expands Product Lineup with Analog Matrix Processor for Edge AI Applications

Tiera Oliver

June 9, 2021

VadaTech Announces a Processor AMC with NXP Layerscape LS1046A (A72 Core)

Tiera Oliver

June 7, 2021

Can FastSPICE Be Anything More than Just Fast?

Cadence Design Systems

June 4, 2021

Recent changes in the semiconductor industry are creating new challenges for verification of memories and SoCs. Verifying these complex designs is complicated because of evolving newer architectures, increasing design sizes due to advanced-node processes, and the exponential increase in layout parasitics.

Sondrel Launches the Fourth IP Platform, SFA 350A, for ADAS ASICs

Tiera Oliver

June 3, 2021

IAR Embedded Workbench for Arm Now Provides Support for the RP2040 Board From Raspberry Pi

Tiera Oliver

June 3, 2021

Sequans Licenses CEVA 5G Modem IP for Broadband IoT Platform

CEVA, Inc.

Sequans Communications S.A.

June 1, 2021