Embedded Computing Design

The Edge XRT v2.0 is available from IOTech. This is a significant release of its open software platform, which is intended for time-critical and embedded OT applications at the industrial IoT edge.

At embedded world 2022, Advantech unveiled the world's first COM-HPC Server-on-Module powered by AMD EPYCTM 7003 Embedded processors. The new COM-HPC Size E Server-on-Modules (200 x 160 mm) provide more than triple the number of available edge server cores compared to any other COM-HPC server module on the market [1], providing edge server engineers with a significant performance boost.

Agile Analog has made its new RC Oscillator IP available for purchase. This is the first in a new family of analog IP blocks that the company is introducing to make it easier to integrate analog circuits onto ASICs.

ROHM Semiconductor announced the RFL/RFS Series, its fourth generation 650V fast recovery diodes (FRDs) with low forward voltage (VF) and fast reverse recovery time (trr), as well as ultra-low noise characteristics. The new devices are ideal for high-power industrial and consumer equipment, such as air conditioners and EV charging stations.

Oxford Ionics and Infineon Technologies AG have announced a collaboration to develop high-performance, fully integrated quantum processing units (QPUs). Oxford Ionics' unique electronic qubit control (EQC) technology, combined with Infineon's world-leading engineering and manufacturing capabilities, as well as quantum technology expertise, will lay the groundwork for the industrial production of QPUs with hundreds of qubits within the next five years. The goal is to transition quantum computing technology from the research lab to real-world applications.

Nexperia has announced the availability of 20 V and 30 V MOSFETs in the world's smallest DFN package, the DFN0603. Nexperia already offers ESD protection devices in this package, but has now succeeded in bringing it to their MOSFET portfolio, an industry first

congatec expands its Intel Xeon D-2700 processor-based Server-on-Module portfolio with the introduction of five new modules in the COM-HPC Server Size D performance class (160x160mm).

congatec introduced seven new COM-HPC and COM Express Computer-on-Modules with less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake).

congatec announced significant investments in functional safety at embedded world Hall 5/Booth 135.

Imagination Technologies' first real-time embedded RISC-V CPU, IMG RTXM-2200, is a highly scalable, feature-rich, 32-bit embedded solution with a flexible design for a wide range of high-volume devices. The IMG RTXM-2200 is a commercial core in Imagination's Catapult CPU family, which was previously announced in December 2021.

A large number of electronic systems in modern vehicles are networked with one another. Because these systems are vulnerable to cyber attacks, Fraunhofer IPMS created a CANsec IP core to improve the security of vehicle systems.

Solid Sands and SYSGO have announced new developments in their four-year collaboration.

Renesas Electronics Corporation announced the development of circuit technologies for a 22-nm embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations.

Avery Design Systems announced comprehensive support for the new UCIe (Universal Chiplet Interconnect Express) standard, allowing design and verification engineers to take advantage of the recently introduced standard for die-to-die interface connectivity. Avery's offering includes high-quality models and test suites for UCIe-based system pre-silicon verification.

Murata announced its NFM15HC435D0E3 capacitor has set a new performance benchmark. The product is the world's first three-terminal multi-layer ceramic capacitor (MLCC) with a capacitance of 4.3 F in a 0402-inch (1.0 0.5 mm) size.

Panaji Municipal Corporation (PWD-PHED) to feature a LoRaWAN® network for water use management

Wireless Telecom Group, Inc. announced today that its CommAgility brand has launched a new four-channel small cell platform for high-performance 5G applications such as industrial private networks, cloud applications, and video streaming.

To meet the growing demand for flexible mesh network designs, Fujitsu Components America introduced the FWM7BLZ22x series of Wirepas Mesh 2.4 GHz embedded wireless modules today.

The first AINVR solution at the edge on the market. It can process up to 8 camera streams and switch between different AI models dynamically.

A new 5x6 mm copper (Cu) clip for MOSFETs that provides an improved thermal path within the package.