In this episode of Embedded Insiders, Dunstan Power, Director of ByteSnap Design, unpacks the strategic and practical implications of Europe’s investment in the semiconductor industry. Dunstan shares his perspective on how this funding could bolster Europe’s chip manufacturing capabilities, address global supply chain challenges and foster innovation for companies like ByteSnap and its clients.

Learn how the low-power, long-range AIROC™ CYW5551x Wi-Fi 6/6E and Bluetooth® combo delivers secure, reliable, high-quality connections for wearables, smart home, industrial and other form factor IoT applications. With the industry’s best transmit power and receiver sensitivity, and interference mitigation, see how this combo family helps your applications reliably operate over long ranges in congested environments.

Learn more: https://www.infineon.com/cms/en/product/wireless-connectivity/airoc-wi-fi-plus-bluetooth-combos/wi-fi-6-6e-802.11ax/

In this episode of Embedded Insiders, we dive into the challenges and solutions shaping AI and identity verification. Pavel Goldman-Kalaydin, Head of AI and Machine Learning at Sumsub shares how his team is tackling deepfake threats while addressing privacy and ethics concerns with cutting-edge, AI-driven tech.

What is rad-hard memory, and when and where should it be used? And what makes it different from conventional memory? The answers may seem obvious, but that’s not the case.

That’s exactly why I spoke to Helmut Puchner, Vice President and Fellow in the Aerospace and Defense division of Infineon Technologies in this week’s Embedded Executives podcast. Obviously, such memories cost more, so you want to be sure you understand when they need to be deployed and when they don’t.

On this episode of Embedded Insiders, Editor-in-Chief, Ken Briodagh, sits down with Patrick Soheili and Kevin Donnelly of Eliyan to highlight the company's new Chiplet Interconnect PHY at 64Gbps in 3nm Process. The multi-die interconnect evolution marches on and Eliyan is getting a lot of attention for its ability to deliver performance and bandwidth like this in either standard or advanced packaging.

At this year's electronica, Infineon is exhibiting its AI solutions designed to build, optimize and, deploy robust edge AI models using DEEPCRAFT Studio, DEEPCRAFT Ready Models, and ModusToolbox. The software solutions are ideal for MCUs like PSOC Edge and PSOC 6 to develop power-efficient intelligent devices for consumers. Join Infineon at Hall C3, Booth 502 to learn about and view demonstrations on its end-to-end edge AI platforms.

Electric vehicles (EVs) contribute to a greener, more sustainable future by eliminating NOx, CO2, and particulate matter (PM) emissions. To further optimize energy efficiency, performance, and range, many EV manufacturers adopt a holistic design approach, incorporating Wide Bandgap (WBG) semiconductors and focusing on the seamless integration and interoperability of key vehicle systems.