Why would you put sensors and power components into the same business unit if you’re a component supplier? That’s what I asked Adam White, President of Infineon’s Power and Sensor Systems Division.

After hearing his response, it made perfect sense—today’s sensors are quickly growing in number and power consumption in the data center, in AI applications, and lots of other places. So it only makes sense to put those engineers in the same room. Adam explained it better than I could, citing lots of power numbers and energy requirements needed by various applications, and how they vary in different regions. Check out this week’s Embedded Executives podcast.

Smart homes, wearables, and small form-factor applications are confronted with meeting the versatility, energy efficiency, space constraints, and future-proof demands of today’s modern devices. In addition, these devices are also expected to provide seamless connectivity and performance with features like advanced, integrated wireless connectivity.

Munich, Germany – Infineon Technologies AG launched the OPTIGA™ Authenticate NBT, a high-performance NFC I2C bridge tag for single-tap authentication and secured configuration of IoT devices. According to the company, it is the only asymmetric cryptography tag for signing and verifying operations in the market, and it is certified as a Type 4 Tag by the NFC Forum.

Munich, Germany – Infineon Technologies AG announced two new CoolGaN™ product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. 

A growing number of designs in just about every application space are turning to AI for a plethora of reasons. As such, the technology is becoming an increasingly popular tool for the engineering community. The reasons for its popularity are many. For example, the end product can be more efficient by automating repetitive tasks, sifting through vast amounts of data for insights. By analyzing user behavior, market trends, and other relevant data points, designers can make more informed choices, leading to more effective designs.

Infineon Technologies AG has extended the development of their SiC MOSFETs to voltages below 650 V, now launching the new CoolSiC™ MOSFET 400 V family based on the second generation (G2) CoolSiC technology introduced earlier this year.

Munich, Germany. Infineon Technologies AG introduced its new PSOC Edge MCU family consisting of the E81, E83, and E84 heightened for machine learning (ML) applications and delivering a scalable range of performance, features, and memory possibilities. The three MCUs support a variety of peripheral sets, on chip memory, hardware security features, and a variety of connectivity options including USB HS/FS with PHY CAN, Ethernet, WiFi 6, BTBLE, and Matter.