Vecow and Kudan revealed a the release of Vecow’s Turnkey SLAM Kit (VTK SLAM Kit). Integrating Vecow’s ultra-compact fanless system with added sensors and IMUs, along with Kudan’s SLAM technologies, this collaboration aims to cater to the rising demand for navigation and mapping solutions in unknown environments.

Vecow launched the 112x103x45mm EAC-4000, an Edge AI Computing System powered by NVIDIA Jetson Orin NX and Jetson Orin Nano system-on-modules. It delivers enhanced AI processing up to 100 TOPS for applications such as traffic vision, auto optical inspection, delivery robots, and other entry-level edge AI use cases. The EAC-4000 utilizes NVIDIA Ampere architecture GPU, Arm-based CPUs, NVDLA engines, LPDDR5 memory and available in 16GB, 8GB, and 4GB versions.

Vecow Co., Ltd. introduced its TGS-1000 Series, a stackable AI PC leveraging a CPU, GPU, and NPU within a single processor. The series supports edge AI applications including AI-accelerated processing, AI-assisted video conferencing, AI-ready immersive gameplay, and 4K streaming. Powered by Intel Core Ultra 7 165H/Ultra 5 135H processor and equipped with robust NPUs (neural processing units), the TGS-1000 Series is ideal for inferencing tasks required by AI.

Compared to their outdoor counterparts, indoor mobile robots are relatively easy to design, as they generally don’t have to worry various weather elements, difficult flooring that needs to be traversed, or unexpected obstructions. The indoor robot is designed to navigate and operate in places like homes, offices, warehouses, hospitals, or factories. These robots use a combination of sensors, software, and sometimes artificial intelligence to understand and interact with their surroundings.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the AI and Machine Learning category:

Embedded Computing Design’s Road to Embedded World will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at Embedded World, April 9^th to 11^th in Nuremberg, Germany. Embedded World is the largest global gathering of its kind. Check back regularly to see where the Road to Embedded World takes us.

Semiconductor manufacturing is an extremely complex process. It’s been that way since the first wafers rolled off the line but is getting far more complex with every generation of devices.