BRUSSELS, Belgium. “The future for Europe as a region of semiconductor manufacturing excellence is brimming with possibility,” said Laith Altimime, president of SEMI Europe when responding on the progress made with the European Chips Act detailing the quick start of the “general approach,” in 2023. Member states as well as the Czech Presidency of the Council reached an agreement on Europe’s advancement in manufacturing next-generation semiconductors.

MILPITAS, Calif. SEMI reported in its 200mm Fab Outlook to 2025 report that the global manufacturing of semiconductors is expected to boost 200mm fab capacity 20% from 2021 to 2025. The additional output will add 13 new 200mm lines as production reaches more than 7 million wafers per month (wpm). Plans to meet the markets growing demand has companies like ASMC, BYD Semiconductor, China Resources Microelectronics, Fuji Electronics, Infineon Technologies, Nexperia and STMicroelectronics reveal plans for new 200mm fabs.

MILPITAS, Calif. In its 300mm Fab Outlook to 2025 report, SEMI compiled data that shows an expansion of 300mm fab capacity will expand to a 10% compound average growth rate (CAGR) from 2022 to 2025, reaching 9.2 million wafers per month (wpm). “While shortages of some chips have eased and supply of others has remained tight, the semiconductor industry is laying the groundwork to meet longer-term demand for a broad range of emerging applications as it expands 300mm fab capacity,” said Ajit Manocha, SEMI President and CEO. “SEMI is currently tracking 67 new 300mm fabs or major additions of new lines expected to start construction from 2022 to 2025.”

SEMI predicts 29 million wafers a month (200mm equivalent) for 2023.

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a record $117.5 billion in 2022, rising 14.7% from the previous industry high of $102.5 billion in 2021, and increase to $120.8 billion in 2023, SEMI announced in releasing its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON West 2022 Hybrid.

SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) revealed that they have won a $300,000 grant from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the United States.

Worldwide silicon wafer area shipments in 2021 increased 14% while wafer revenue rose 13% compared to 2020, topping $12 billion to reach new all-time highs, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.