congatec announced their latest embedded versions of the 8th-generation Intel Core Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5-inch SBCs, and Thin Mini-ITX motherboards. Enabled by 4 cores instead of 2 as well as an improved microarchitecture, device features include optional Intel Optane memory 2 or USB 3.1 Gen2, with support for RTS hypervisor software to allow additional optimization of I/O throughput from the input channels to the processor cores.

Designed for harsh and space-constrained environments, the Intel Core i7, Core i5, Core i3, and Celeron embedded processor boards and modules offer long-term availability of 10+ years. Addressing in particular the increased life cycle needs of the transportation and mobility sector, the boards and modules enable extended lifecycles without additional costs.

"We are very happy to get our hands on embedded versions of this brand new Intel architecture with 10+ year long-term availability. Longer life cycles are a key requirement in many mobile applications we target in rugged environments, where high speed data streams need to be acquired and logged for 3D object recognition, lidar imaging, and mobile mapping. The same requirement that our end customers expect from our data recorders used for wireless network monitoring and automotive test systems or data loggers for test vehicles, which store and analyze high speed data streams from external sensors on solid state drives or hard drives," explains Thomas Hagios, CEO of MCTX Mobile & Embedded Computers GmbH.

The conga-TC370 COM Express Type 6 modules, the conga-JC370 embedded 3.5-inch SBCs, and the conga-IC370 Thin Mini-ITX motherboards all feature the latest Intel Core i7, Core i5, Core i3 and Celeron embedded processors with a long-term availability of 15 years. The memory is designed to match the demands of consolidating multi OS applications on a single platform: Two DDR4 SODIMM sockets with up to 2400 MT/s are available for a total of up to 64GB.

USB 3.1 Gen2 with transfer rates of 10 Gbps is now supported natively, with the 3.5-inch SBCs providing this performance via a USB-C connector that also supports 1x DisplayPort++ and power supply for peripheral devices, enabling a single-cable connection. The COM Express modules support the same feature set on carrier boards. Further interfaces depend on the form factor, but all support a total of 3 independent 60Hz UHD displays with up to 4096x2304 pixels as well as 1x Gigabit Ethernet (1x with TSN support). The new boards and modules offer all this and many more interfaces with a 15W TDP scalable from 10W (800 MHz) to 25W (up to 4.6 GHz in Turbo Boost mode).

Learn more at www.congatec.com/intel-whiskey-lake.