Wincomm Takes its Medical Solutions to COMPUTEX
May 31, 2024
News
Wincomm is participating in COMPUTEX 2024 where it invites visitors to Booth No. PO504 in Hall 2, 1F to explore its latest CPUs powered by Intel’s 13th/14th generation core (Code name Raptor Lake) supporting Nvidia/Intel graphic cards that deliver “ready for precision” medical solutions. It will also introduce its innovative 27” medical OR AIO PC, WMP-27T, specifically designed for operating rooms.
Products on Display:
WMP-19S/22S/24S
- Intel 13th / 14th Gen. Core Processor
- Nvidia MXM RTX-A4500 / A2000 / A1000
- Optional UPS Battery
- Up to 6 x USB Type A, 1 X USB Type C, 4 X COM, 1 X PCIex4 Expansion
- Support Power Up to 250W
- 2 X Display Out, 1 x Video In (HDMI)
WPC-789-PSI
- Intel 13th / 14th Gen. Core Processor
- Nvidia RTX-A6000 / A4000 / A2000
- Power Supply Unit Inside, Up to Power 500W
- Up to 7 USB Type A, 1 X USB Type C, 2 X COM, 3 X LAN
- Up to Three Storage, 4TB
WMP-15P/19P/22P-IP54/24P-IP54
- Intel 13th Gen. Core Processor
- IP65 Front, IPX1 Rear for 15” and19”, IP54 Rear for 22” and 24”
- Optional UPS Battery
- Up to 6 x USB Type A, Up to 6 x COM, 2 X Display Output, 1 x PCIex4 Expansion
- Support Power Up to 100/180W
WTC-9H0(W) -Six sides waterproof embedded PC
- Intel 12th / 13th Gen. Core Processor
- Low Power Fanless Waterproof Box PC
- IP66/68 Full Sealed with Anti-Corrosion Stainless Steel Enclosure
- Wide Range DC Input 12~28V
- Optional M12 Stainless/Metal Connectors
- Optional Cable Gland for External I.O.
WTPE-9H66-22W (Preliminary) – C1D2 ATEx Zone 2 EX-Panel PC
- Intel® 13th Gen. Core i5 Processor
- 21.5”Fanless for Wide Temp -10~55°C Environments
- LAN USB COM M16 (EX Ec) I.O. Up to 4
- Waterproof M12 USB COM (EX ic) I.S. Output Up to 2
- Connector Panel for Easy Cable Installation
- Totally Sealed IP66 / NEMA 4X Enclosure
- 100% Water/Dust Proof Guarantee
For more information, visit wincommusa.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
