All entries are judged using a 15-point rubric, that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.

All entries are judged using a 15-point rubric, that assesses design excellence, relative performance, and market impact/disruption. Judging is managed by the ECD Content Team.

Exascend will be located at Booth 1935 during this year’s embedded world North America highlighting its comprehensive storage solutions designed to withstand the rigors of the road, space, and industrial. From SSD modules to memory cards, these solutions ensure durability and reliability in challenging environments.

Taipei, Taiwan. Exascend introduced its soldered DRAM-less AS500 series NVMe Ball Grid Array solid state drive (BGA SSD) designed to meet demanding data storage needs of next generation connected autonomous vehicles in rugged environments. The solution supports an operating temperature of -40°C to +105°C with shock and vibration control utilizing Exascend's proprietary Adaptive Thermal Control algorithm.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the Memory & Storage category:

Embedded Computing Design’s Road to Embedded World will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at Embedded World, April 9th to 11th in Nuremberg, Germany. Embedded World is the largest global gathering of its kind. Check back regularly to see where the Road to Embedded World takes us.

Exascend, Inc. recently unveiled additions to its PCIe 3.0 PE3 and PI3 series in the form of industrial- and enterprise-grade, wide-temperature PCIe NVMe U.2 SSDs in 16 TB or 15,360 GB capacity. U.2 SSDs provide overall improvements over M.2 SSDs in latency, thermal performance, power consumption, and capacity to form factor ratio, making them suitable for deployment in enterprise data centers migrating to high-performing SSD use from traditional HDDs.