Embedded Computing Design

In this podcast we talk to John Hacskaylo and Scott Fisher of Black Diamond about the use of carbon nanotubes to improve batteries.

GSM connectivity enables devices to use extensive GSM network that exists almost everywhere.

A machine learning core in the sensor works with integrated finite-state machine logic to classify motion data based on known patterns.

WiBotic is partnering with GaN Systems to provide off-the-shelf solutions for rapidly charging the rapidly-growing robotics ecosystem.

Infineon Technologies MERUS line unites the existing portfolio of multi-chip modules and discrete audio products under one umbrella.

An important factor in high-performance computing is how you manage power, and whether you're optimizing device performance. That's where advanced current sensors come in.

Trinamic Motion Control introduced a high-power gate driver for PMSM servo or BLDC motors.

STMicroelectronics' LED1202 12-channel LED driver enables smoother interactions with smart devices, wearable electronics, and small appliances.

AVX released the TransGuard VT Series, presented as the first multilayer varistor (MLV) transient voltage suppression (TVS) devices rated for 175?C operation.

congatec will be exhibiting at Japan IoT/M2M Expo (booth 10-42 West Hall 2, 1F), showcasing its latest demo platforms for next-generation Artificial Intelligence (AI) based embedded vision systems.

RECOM's REC15E-Z Series 15W DC-DC converters, suitable for cost-sensitive applications where board space is at a premium, are now available from Rutronik.

Kyocera and Vicor will collaborate on next-generation Power-on-Package solutions, to maximize performance and minimize time-to-market for emerging processor technologies.

The Power Sources Manufacturers Association (PSMA) unveiled the 2019 edition of their Power Technology Roadmap.

Russelectric released Prime Power Systems, used for automatic operation of on-site power generators to serve a facility?s entire load.

Bridgetek announced a three-way collaborative partnership with Zerynth and Riverdi to develop next-generation smart-building systems and Industry 4.0-ready factory automation equipment.

B?-LA and TactoTek announced an agreement for B?-LA to market and sell TactoTek?s injection-molded structural electronics (IMSE).

Infineon Technologies extended its Easy family to include the Easy 3B package, along with the Easy 1B and 2B.

Ampleon announced a high-efficiency 750W RF power transistor, the BLF0910H9LS750P, with a best-in-class efficiency of 72.5 percent at 915MHz.

Rohde & Schwarz announced approval for its cellular vehicle-to-everything (C-V2X) protocol conformance testing package, per the Global Certification Forum (GCF).

Alfamation released the WSC-6 RF wireless test chamber, presented as three times smaller than available alternatives.