Embedded Computing Design

Well-suited for electronic warfare (EW), SIGINT, radar and communications applications, the flight-qualified chassis is a complete functional demonstration system.

Bicker Elektronik?s UPSI-1208IP-23UW with 12VDC output (8A) and UPSI-2406IP-24UW with 24VDC output (5.42A) are dust and waterproof in accordance with IP67.

Flex Power Modules? BMR490 DC-DC converter with active current sharing enables two or more converters to be used in parallel for demanding datacom applications.

Diodes Incorporated?s AL3644 high-speed, dual-channel flash LED driver combines flexible switching-frequency capabilities with constant output current.

Sterlite Technologies Ltd (STL) unveiled its programmable FTTx (pFTTx) solution for fiber-based access connectivity.

SMART Embedded Computing announced the availability of the PCIE-7217 PCI Express card, featuring Intel?s Core i7 processor, along with Radeon RX Vega M graphics.

Integrated Device Technology (IDT) introduced a software-upgradeable, digital outdoor air-quality sensor for high volume applications.

The HVLED007 AC/DC LED driver from STMicroelectronics is a current-mode PFC controller optimized for use with isolated, high-power-factor, quasi-resonant flyback converters.

Analog Devices announced the ADuM4122, an isolated, dual-drive strength output driver that uses iCoupler technology.

congatec launched a 100 Watt ecosystem, designed for embedded edge and micro servers that increasingly utilize 65-100 Watt COM Express Type 7 Server-on-Module performance.

Mouser Electronics has signed a global distribution agreement with Transphorm, manufacturers of gallium nitride (GaN) transistors for high-voltage power conversion applications.

Enclustra's Mercury+ XU9 SoC module offers 20 multi-gigabit transceivers with data rates of up to 15 Gbit/sec each, and memory bandwidth of up to 38.4 GByte/sec.

ROHM announced the availability of a buck-boost DC-DC converter with integrated MOSFET, the BD83070GWL.

Senseg launched a family of flexible actuators for applications such as wearables, soft robotics, VR/AR devices, and interior integrated sensors that is based on roll-to-roll manufacturing.

The Next Generation Mobile Networks (NGMN) Alliance announced that it recommends a common RF cluster connector for early 5G deployment.

The joint sponsors of the Applied Power Electronics Conference (APEC) announced the continuation of the Student Attendance Travel Support Program.

Mouser Electronics is now offering the Power by Linear LTM4700 ?Module regulator from Analog Devices. The LTM4700 is a dual 50A or single 100A step-down DC/DC regulator solution that incorporates...

Eurotech and Infineon Technologies will offer Infineon?s Trusted Platform Module (TPM) integrated in Eurotech?s IoT Edge Gateways to protect device identity. Eurotech will include Infineon?s OPTIGA...

The first models of Alvium cameras from Allied Vision includes three 1500 series models with a MIPI CSI-2 interface, and one 1800 series model with USB3 Vision interface. To coincide with the...

Toposens released the TS3 3D ultrasonic sensor, suitable for applications that require reliable object detection and situational awareness. The 3D sensors offer a field of view up to 160? and...