Embedded Computing Design

Infineon Technologies AG introduced the new 650 V TRENCHSTOP 5 WR6 family.

As an interface between the electric vehicle and the power electronics, vSECC.single controls the charging transmission for the Combined Charging System (CCS) in accordance with ISO 15118-2 and DIN SPEC 70121.

The Small form factor RistrettoBin module is designed for low power applications where battery life is a critical need.

Sondrel's new SFA 100 IP reference platform makes creating high-performance battery powered IoT devices fast and easy.

ROHM Semiconductor revealed two new buck DC/DC converter ICs with built-in MOSFET, the BD9G500EFJ-LA and BD9F500QUZ.

STMicroelectronics’ WiSE Studio, is accelerating the design of smart, connected devices that leverage the latest Bluetooth technology.

u-blox announced the release of two "explorer kits" aimed at allowing product developers the ability to evaluate the potential of Bluetooth direction finding and high precision indoor positioning.

Renesas Electronics Corporation unveiled a family of new 700V buck regulators that deliver superior power consumption, noise and EMI suppression, as well as reduced overall system cost.

The speed with which edge AI ecosystems like TinyML are evolving has made standardization difficult, much less the creation of performance and resource utilization benchmarks that could simplify technology evaluation. Edge AI benchmarks would be hugely beneficial to the ML industry as they could help accelerate solution comparison, selection, and the productization process.

Quantum-driven device fingerprinting beats all attempted side-channel attacks at independent test house

Review Display Systems Inc. announced the availability of a new 5.0-inch TFT display module.

ON Semiconductor announced that Sierra Wireless  has selected QCS-AX Wi-Fi 6 chipsets to power the Wi-Fi functionality of its XR Series of multi-network 5G routers.

Superior Sensor Technology announced Particles Plus has adopted its differential pressure sensor technology in their next-generation air quality monitoring instruments.

The new land grid array (LGA) module TQMa8MPxL based on the i.MX 8M Plus CPU measures only 38x38mm. The module provides all signal pins on a total of 362 LGA pins. The module is equipped with a 32-bit wide LPDDR4 SDRAM, which allows a memory expansion of up to 4GB.

ACEINNA Inc. announced the availability of the OpenIMU335RI, a rugged inertial measurement unit (IMU) with CAN and RS232 interfaces.

Menlo Microsystems, Inc. has announced a new double-pole/double-throw (DPDT) switch providing superior performance and data rates for high-speed differential switching applications.

Nordic Semiconductor announced it has partnered with Memfault, to enable developers using its nRF91, nRF53, and nRF52 Series low power cellular IoT and short range wireless solutions to access the ‘Memfault’ remote debugging and monitoring platform via its nRF Connect SDK.

ABI Research predicts 5G positioning to drive adoption of RTLS solutions, however, current 5G roadmap will prevent large scale rollouts before 2025

Maxim Integrated Products, Inc. unveiled the MAX98396 Class D/G speaker amplifier.

Digi International announced the expansion of its ConnectCore family of products with the introduction of the Digi ConnectCore 8M Mini System on Module (SOM).