Data is the foundation of smart factory and Industry 4.0 value, and that data is captured by sensors at the edge. Transforming that data into intelligence requires the convergence of the IT and OT domains, which begins with smart sensors.

congatec welcomed the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.

Embedded systems are specified for varying requirements, typically based on the application it will drive. It could be long life, low power, small size, or maximum compute power. If your application fits the latter category—maximum compute power—then the ADLINK Technology COM-HPC Ampere Altra server module likely fits the bill for you.

The PICMG has defined a set of standardized side-band/out-of-band management commands for the recently published COM-HPC Server-on-Module standard. It is called the COM-HPC Platform Management Interface specification, or COM-HPC PMI for short.

On this episode of Embedded Insiders, Brandon and Rich ponder the possible reasons NVIDIA’s acquisition of Arm is on the brink of collapse.

To accelerate the development and deployment of smart sensors in Industry 4.0 applications, the PICMG IoT.1 specification outlines a standard data model for sensor manufacturers and systems integrators. In Part 1, we look at the requirements of a smart sensor and outline the tools required to make your own.

PICMG announced the ratification of IoT.1 specification defining a communication standard between sensors / effecters and local IoT controllers such as micro Sensor Adapter Modules (microSAM) already specified by PICMGs IoT.0 specification.