At embedded world 2025, Ceva (Hall 4, Booth 462) will highlight its leading-edge wireless communications and Edge AI IP innovating smart edge devices for the future. Enabling seamless edge intelligence, Ceva’s solutions allow billions of devices to connect, sense, and analyze data efficiently. Ceva will demonstrate how AI-driven connectivity is a growing importance with advancements in Bluetooth technology and fresh use cases for edge NPUs in embedded ML applications.

Ceva, Inc. released Ceva-Waves Links, an innovative lineup of multi-protocol wireless platform IPs. The IPs are designed to support the most recent wireless standards, catering to the increasing demand for chips with enhanced connectivity features targeting Smart Edge devices in consumer IoT, Industrial, automotive, and personal computing.