Texas Instruments
TI Introduces New Magnetic Packaging Technology for Power Modules - News
July 24, 2024DALLAS -- Texas Instruments (TI) introduced six new power modules designed to improve power density, enhance efficiency, and reduce EMI. These power modules leverage TI's proprietary MagPack integrated magnetic packaging technology, shrinking their size by up to 23% to support industrial, enterprise, and communications application designers.
COMPUTEX 2024 & Robotics AI and Sensing with Texas Instruments - Podcast
June 13, 2024On this episode of Embedded Insiders, Senior Technology Editor, Ken, and Errol Leon, System Engineering & Marketing Manager of Robotics at Texas Instruments (TI) discuss the work of robotics in collaboration with humans and the role of motor control, board-to-board communication and sensor fusion in the future of robotics.
But first, Rich and Ken recap a recent trip to Taipei for COMPUTEX 2024.
TI Introduces Industry's First GaN IPM Solution for High-Voltage Motors - News
June 11, 2024DALLAS -- Texas Instruments (TI) introduced the industry's first 650V three-phase GaN IPM for 250W motor drive applications. The new GaN IPM addresses the design and performance compromises in major home appliances and heating, ventilation, and air-conditioning (HVAC) systems.
TI to Showcase Technologies for a Safer, Smarter and More Sustainable Future at embedded world 2024 - News
April 05, 2024DALLAS, March 13, 2024 /PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today announced that it will demonstrate new embedded processing and connectivity products for enabling a safer, smarter and more sustainable future at embedded world, April 9 through 11 in Nuremberg, Germany. TI's exhibit in hall 3A, booth 131 will showcase the latest advancements in application areas such as robotics, energy transition and electric vehicles.
TI Introduces New Power Conversion Portfolios to Support Low-Cost Power Density - News
February 26, 2024DALLAS -- Texas Instruments (TI) introduced two new power conversion device portfolios to help engineers achieve more power in smaller spaces, and provide high power density at a low cost.
Embedded Executive: We’ve Moved Past the GaN Starting Gate, TI - Podcast
January 24, 2024We appear to be over the hump between hype and reality when it comes to GaN technology. Components and end products are readily available. But according to David Snook, the product line manager for GaN products at Texas Instruments (TI), we are just scratching the surface of where GaN’s potential lies. Hear more in this week’s Embedded Executives podcast.
Defining & Democratizing Edge AI - Podcast
January 04, 2024On this episode of Embedded Insiders, Artem Aginisky, product line manager of arm-based processors at Texas Instruments, dives into the topic of edge AI, specifically, how he defines edge AI and how TI is working on democratizing edge AI through innovations in microprocessors and software.