Embedded Computing Design

Las Vegas, Nevada. MyRadar will be showcasing its “Powered by MyRadar'' during its stay at CES 2024. Powered by MyRadar gives designers the capability to embed environmental data into apps and software solutions with off-the-shelf customizable applications, APIs, and software development kits. Also offered is MetDesk, where users can talk to a real-time meteorologist on demand.

The Industrial Technology Research Institute (ITRI) will be located in booth 9255, North Hall, LVCC, at CES 2024 as well as being a part of CES Unveiled Las Vegas, booth 226, Shoreline Exhibit Hall, Mandalay Bay Convention Center. ITRI will showcase many of its AI supported platforms ranging from sports to manufacturing. 

Coral Springs, Florida. Rutronik will be attending its first CES at this year’s CES 2024, where they will be in the German Pavilion holding down Booth 55439-04. Rutronik is planning to demonstrate its power reference designs for the e-mobility industry and sensor evaluation boards. Rutronik’s portfolio also consists of semiconductors, embedded, wireless, passive, and electromechanical solutions.

Solana Beach, California. Macnica will be attending CES 2024 with its next generation solutions for AI and autonomous driving. While visiting CES, stop by Booth N9417 to see platforms consisting of automated driving and advanced mobility, research software for driver experiences, remote monitoring and control, and remote data collection for automotive telemetry.

San Diego, California. At CES 2024, Silanna Semiconductor will showcase its ACF (active clamp flyback) platform in the Vinpower iXCharger universal charging and storage cube. The charger was presented the Innovation Award at CES 2024 and will be viewable at Central Hall, booth #16646, and the Innovation Awards Showcase.

Sunnyvale, California. Intrinsic ID will attend CES 2024 as part of the Dutch Pavilion in booth 62100. Intrinsic’s security specialists will be showcasing its root-of-trust (RoT) solutions which are deployed in over 650 million devices globally.

Bromont, Quebec. Boréas Technologies released its Boréas CapDrive BOS0614, the first Solid-State Haptic Button platform for smartphones with multichannel and ultra-low-power (under 10 μA in sleep mode) piezo haptic driver with integrated force-sensing. The solution is packed in a small WLCSP (2.1x2.5x0.5 mm) with support for up to four buttons. With an IP68 waterproof design, the Boréas CapDrive Haptic Buttons are rugged and do not succumb to dust or oils when utilized in the field.

Seattle, Washington. TEAL released Aurora, its next-generation IoT Connectivity Management Platform (CMP). The solution monitors and manages IoT components and data network connections with easy one click installation of new networks. Other benefits include user friendly switching between existing networks, tracking data, and monitoring real-time device condition.

BlackBerry Limited is attending CES 2024 with its automotive solutions powered by its IVY vehicle data platform through on-site demonstrations highlighting industry partners. IVY was developed to be an in-vehicle AI capable design friendly platform.

CES 2024 will have Owl AI demonstrate an industry first ADAS safety technology for Pedestrian Automatic Emergency Braking (PAEB) at night. Visitors will get a firsthand look at the innovative work when visiting Booth 6867 (West Hall). The solution arrives before the new NHTSA mandate for pedestrian safety. At its booth, Owl will discuss how its LWIR thermal imaging, when combined with computer vision, will detect life better than any differentiated sensing systems.

Samtec, Inc. released its HSEC6-DV Series of PCIe 6.0 capable Generate high-speed edge card socket solution for 64 Gbps PAM4 (32 Gbps NRZ) applications. The HSEC6-DV utilizes typical PCIe 6.0 AI hardware designs connecting motherboard to supplemental cards. For signal reliability and lifecycle extension, the HSEC6-DV is delivered with Edge Rate contacts in a variant pair configuration on a 0.60 mm pitch.

Pleasanton, California. Alif Semiconductor is now offering its entire 32-bit microcontroller and fusion processor catalogue for global distribution. The Alif Ensemble family utilizes single-core and dual-core RTOS MCUs leveraging Arm Cortex-M55 CPUs with optional Arm Ethos-U55 microNPUs for 10x AI/ML performance when compared to similar 32-bit MCUs.* Also available are triple- and quad-core fusion processors with Cortex-A32 CPUs for Linux and other operating systems.

Norwood, Massachusetts. United Electronic Industries (UEI) introduced its ISO 17025 compliant 6.5 Digit Digital MultiMeter DNx-DMM-261 I/O board delivering digital multimeter (DMM) functionality to UEI’s rugged chassis series. The board leverages UEIDAQ Framework for the ability to utilize the most recognized operating systems and programming languages. 

Sunnyvale, California. Intrinsic ID announced its QuiddiKey 400 solution, meeing the demands of ISO 26262 Automotive Safety Integrity Level (ASIL) B fault metric and ASIL D for systematics failures. The hardware-based root-of-trust (RoT) utilizes SRAM PUF technology for strict security measures. “Security threats are everywhere. This is particularly true for safety-sensitive markets like the automotive industry,” said Pim Tuyls, CEO of Intrinsic ID.

Imagimob released its complete machine learning (ML) IMAGIMOB Ready Models requiring zero or limited engineering expertise for near plug-and-play with current microcontrollers like PSoC 6. “This is a much easier way for companies to begin their ML journeys—they don’t have to make such a big investment to start using it on their edge devices,” says Anders Hardebring, CEO at Imagimob.

Miami, Florida. Klika Tech earned the Amazon Web Services (AWS) Advertising and Marketing Technology Competency in Digital Customer Experience. As an AWS Partner Network (APN) member, Kilka Tech has proven its technical proficiency and customer success in its AWS cloud solutions. 

Uppsala, Sweden. IAR is now supporting NXP Semiconductors’ S32M2 motor control for software-defined electric vehicles within its IAR Embedded Workbench for Arm. According to IAR, the solution provides a next level compiler and debugger for S32M2 devices that are based on Arm Cortex-M microcontroller cores. Integrated within the C/C++ suite is also the ability to monitor power consumption for more sustainable options.

Cincoze released its new panel PC series, the P2202+CV/CS/CO Series powered by Intel’s Core U-series (Alder Lake-P) processor. There are currently two models in the family, the P2202 and the P2202E (PCIe expansion 75W). Memory consists of 64GB of DDR5 4800MHz inside a 254.5 x 190 x 41.5 mm form factor.

Chesham, Buckinghamshire, United Kingdom. Sundance Multiprocessor Technology released a new module combining Microchip’s PolarFire SoC MPFS250T from Trenz Electronic and Sundance’s open-source EMC²-DP PC104 SoM Carrier (40mm x 50mm). Sundance believes the solution will revolutionize the PC104 standard with the power and precision from Microchip and the flexibility and open-source of its EMC²-DP PC104 SoM Carrier.

 

Uppsala, Sweden. IAR CTO, Anders Holmberg, offered the following perspective on what free costs, “Free tools may seem like a good idea, but they often result in higher long-term costs due to inefficiencies and the need for additional resources to compensate for their limitations.” To help combat lost money, when trying to save, IAR released its Total Cost of Ownership (TCO) calculator to its Embedded Workbench.