Embedded Computing Design

American Portwell Technology, Inc., released the PCOM-BA02GL, a COM Express Type 10 Mini module (84mm x 55mm) based on the 10nm Intel Atom x6000E Series/Pentium/Celeron. 

Allied Vision has integrated Sony's modern SenSWIR InGaAs sensors in its popular Goldeye SWIR camera series.

Pliops announced the launch of its Extreme Data Processor (XDP)., Pliops XDP increases performance, reliability, capacity, and efficiency.

Maxim Integrated Products, Inc. and Xailient Inc. announced that Maxim Integrated’s MAX78000 ultra-low power neural-network microcontroller detects and localizes faces in video and images.  

Advantech has released the EI-52 Edge Intelligence System, an 11th generation Intel Core processor-based industrial PC that is packaged with the EdgeX open-source software framework and the company’s own WISE-DeviceOn IoT management platform.

Microchip Technology Inc. announced a new Qi 1.3 wireless charging reference design to meet the new Qi 1.3 specification from The Wireless Power Consortium (WPC).

WisBlock's modular setup can be utilized for building IoT projects from scratch or supplementing existing IoT solutions

Murata announced the MGJ2 series, a new line of surface mount DC-DC converters. 

E-PEAS has unveiled a new family of battery charger devices for streamlined power management solutions designed for energy harvesting hardware. 

The Rohde & Schwarz technology group is now working in the field of quantum computing.

Infineon Technologies AG introduced the new 650 V TRENCHSTOP 5 WR6 family.

As an interface between the electric vehicle and the power electronics, vSECC.single controls the charging transmission for the Combined Charging System (CCS) in accordance with ISO 15118-2 and DIN SPEC 70121.

The Small form factor RistrettoBin module is designed for low power applications where battery life is a critical need.

Sondrel's new SFA 100 IP reference platform makes creating high-performance battery powered IoT devices fast and easy.

ROHM Semiconductor revealed two new buck DC/DC converter ICs with built-in MOSFET, the BD9G500EFJ-LA and BD9F500QUZ.

STMicroelectronics’ WiSE Studio, is accelerating the design of smart, connected devices that leverage the latest Bluetooth technology.

u-blox announced the release of two "explorer kits" aimed at allowing product developers the ability to evaluate the potential of Bluetooth direction finding and high precision indoor positioning.

Renesas Electronics Corporation unveiled a family of new 700V buck regulators that deliver superior power consumption, noise and EMI suppression, as well as reduced overall system cost.

The speed with which edge AI ecosystems like TinyML are evolving has made standardization difficult, much less the creation of performance and resource utilization benchmarks that could simplify technology evaluation. Edge AI benchmarks would be hugely beneficial to the ML industry as they could help accelerate solution comparison, selection, and the productization process.

Quantum-driven device fingerprinting beats all attempted side-channel attacks at independent test house