Embedded Computing Design

As electronics continue to invade more and more aspects of our daily lives, there is an obvious trend toward greater integration. Other than just simply making space for a rigid 2D circuit board (PCB) within a product, electronic functionality will be either mounted conformally onto surfaces or incorporated within the structural materials.

Advanced Thermal Solutions, Inc. (ATS) is now delivering DIY cold plates for engineers to custom fit onto devices where electronics need to be thermally managed for accurate implementation.

Rambus Inc. announced it has signed an agreement to acquire Hardent, Inc. The signed agreement expands the team of engineers at Rambus and hastens the development of CXL processing solutions for next-generation data centers.

DIGISTOR is redefining secure Data At Rest storage with drives to carry Common Criteria validation, the DIGISTOR FIPS 140-2 L2 M.2 NVMe SED.

XJTAG released a new software designed to speed up the development and debugging of boundary scan setups. The software can also be utilized to help curtail production line operators being distracted by too much information during test runs.

OK3568-C single board computer(SBC) is designed with SoM FET3568-C on carrier board by four ultra-thin connectors. The board guarantees the SoM source fully available to accomplish fast evaluation processes. The board is designed with ESC solutions, simplifying designing reference to help lesson their their time-to-market.

Researchers from Japan design a tunable physical reservoir device based on the dielectric relaxation at an electrode-ionic liquid interface.

ETSI released a Group Report, ETSI GR SAI 006, outlining the role of hardware in the security of artificial intelligence (AI).

With 5G wireless controlling the landscape of embedded design in 2022, Microchip’s 8-bit PIC and AVR microcontroller (MCU) families are adding market value. Microchip Technology Inc.  announced the release of five new product families and over 60 new individual devices that offer embedded designers simple solutions to common problems.

Kontron introduced its COM-HPC Client COMh-caAP and COM Express compact Type 6 COMe-cAP6. The new modules are based on 12th Gen Intel Core processors (H-series, former codename Alder Lake P).

Dimension Four announced a partnership with Memfault to support IoT companies in developing scalable and efficient devices. Device makers can more quickly build two key components of their IoT design, device-to-app data transfer, and robust remote device diagnostics.

Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.

Innoscience Technology announced an ultra-high-density 140W power supply demo that uses the company's high- and low-voltage GaN HEMT devices to attain efficiencies of over 95% (230VAC; 5V/28A). Measuring just 60x60x22mm (2.4x2.4x0.9in) the PSU has a class-leading power density of 1.76W/cm3 (29W/in3).

TouchNetix announced a fully integrated aXiom touchscreen chip offering a new 3D sensing capability by detecting air gestures allowing for touchless functions in a variety of automotive, industrial, and consumer environments.

e-con Systems launches qSmartAI80_CUQ610, a Qualcomm AI vision kit based on Sony STARVIS IMX415. This ready-to-deploy AI camera kit is suitable for running image-based machine learning and deep learning models at the edge.

Review Display Systems (RDS) announced availability of a complete range of industrial specification, wide aspect ratio 7.0-inch TFT display modules.

Keysight Technologies, Inc. introduced a new 120 Giga Baud (GBd) High-Performance Bit Error Ratio Test (BERT) solution (M8050A) for validating next generation chip deployments of up to 120 GBd for 1.6T (or one trillion bits per second) market with unachieved signal integrity. 

congatec has made available new Computer-on-Modules for 5G connected smart factories and industrial automation designed to simplify and accelerate the development of collaborative robotics and material handling systems.

The fifth visit on our road to embedded world is Arezzo, Italy, for a sneak peek at what SECO is planning for embedded world 2022.

Battery Energy Storage Systems (BESS) require communication capabilities to connect to batteries and peripheral components, communicate with the power grid, monitor systems remotely, and maybe one of the keys to solve the energy crisis and make the world more sustainable.