ACM Research released new alloy anneal capabilities for its Ultra Fn Furnace tool.

The Ultra Fn Furnace tool was developed to operate under protective inert gas, reductive gas conditions or high vacuum conditions down to the micro-Torr level. It was specially created in the wafer handling system, process tube, and boat. The device is also able to be applied for thing wafer or taiko wafers.

Further, it’s intended for batch processing up to 100, 300mm wafers.

Per a company press release, it may be extended into low-pressure chemical vapor deposition (LPCVD) process for SIN, HTO, un-doped poly, and doped poly deposition, gate oxide deposition process, ultra-high temperature processes up to 1200°C, and atomic layer deposition (ALD). 

According to research from Mordor Intelligence, the IGBT market was valued at USD 5.4 billion in 2019, and it is expected to reach USD 9.38 billion by 2025, at a CAGR of 9.66%, during the forecast period (2020-2025).

Requirements for IGBT also increase as chip technology becomes more advances. IGBT applications, such as EVs, need faster switching, enhanced power efficiency, and higher power density.

For more information, visit https://www.acmrcsh.com/.