STMicroelectronics Announces GUI Design for Low-Cost Devices with TouchGFX Updates and New STM32 Nucleo Shield

Tiera Oliver

October 12, 2020

Dealing with Industrial Applications in Harsh Environments

Rich Nass

October 9, 2020

Efinix Announces Availability of Reconfigurable Acceleration Platform (RAP) Initiative

Perry Cohen

October 8, 2020

Avnet Releases New RFSoC Development Kit for mmWave

Perry Cohen

October 8, 2020

Eurotech Announces CPU-180-02, a SIL2-enabled module with the 11th Gen Intel? Core? processors

Eurotech

October 8, 2020

Eurotech Announces CPU-180-01, a COM-HPC module with the 11th Gen Intel Core processors

Eurotech

October 8, 2020

STMicroelectronics Introduces Bluetooth 5.2-Certified SoC

Tiera Oliver

October 8, 2020

NVIDIA to Host Digital GTC in October Featuring Keynote from CEO Jensen Huang and Continuous Programming Around the World

NVIDIA

October 6, 2020

Global Online Conference on Oct. 5-9 to Feature 500+ Sessions in AI, Data Science and More; Live Content and Interaction with Tech Leaders Worldwide

IBASE Rolls Out Slim-Type Fanless System with 8th Gen Intel? Core? Processors

IBASE

October 6, 2020

Product of the Week: Microchip PolarFire SoC FPGA Icicle Kit

Embedded Computing Design Staff

October 6, 2020

Ultralow Noise, High Current, Compact DC-to-DC Converter Solution for Signal and Data Processing Circuits

Analog Devices

October 5, 2020

Renesas I3C Bus Extension and SPD Hub Devices Qualified for ASPEED AST2600 Baseboard Management Controller

Tiera Oliver

October 5, 2020

TQ Introduces New Intel Atom x6000E Based Computer-on-Module Product Family

Tiera Oliver

October 5, 2020

SmartDV Delivers First-to-Market MIPI A-PHY v1.0 Verification IP

Tiera Oliver

October 5, 2020

Software Considerations for Heterogeneous Arm Cores in Safety-Critical Applications

Green Hills Software

NXP Semiconductors

October 2, 2020

ADLINK Announces Release of IP69K-Rated Stainless Steel Panel PC Series

Perry Cohen

October 2, 2020

Serial Memory Technology

October 1, 2020

MIPI Alliance Announces Availability of MIPI Debug for I3C v1.0

Perry Cohen

October 1, 2020

WINSYSTEMS Releases Three PC104 I/O Module Upgrades

Tiera Oliver

October 1, 2020

PCM-MIO-A-1, PCM-UIO48C-16 and PCM-UIO96C-16 modules incorporate latest technology and provide reliable performance in industrial -40C to +85C operating environments.

Microchip Releases Icicle Dev Kit for PolarFire FPGAs

Perry Cohen

September 30, 2020

Microchip Technology announced the release of the Icicle Development Kit for PolarFire (SoC) FPGAs, what they are calling the first RISC-V-based SoC FPGA development kit.

Using SBCs to "Sense" at the Edge

George Hilliard

September 29, 2020

In some cases, computations occur at the Edge, a decision is made, and an action is carried out. In other configurations, the data is sent back to the Cloud to perform the calculations.

ADLINK Releases cExpress-TL, COM Express Type 6 Module

Perry Cohen

September 25, 2020

ADLINK released the cExpress-TL, its newest generation COM Express Type 6 module. The module is based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor.

SECO PRESENTS ITS FIRST COM-HPC MODULE WITH THE 11TH GENERATION INTEL CORE PROCESSORS

SECO

September 25, 2020

COM Express Type 6 and COM-HPC Client: Two great options

Christian Eder

September 24, 2020