Solectrix to Introduce its proFRAME Base Board 3.1 PXIe Targeting Aerospace, Automotive, and Railway Test Applications at embedded world Germany

By Chad Cox

Production Editor

Embedded Computing Design

February 18, 2026

News

Solectrix to Introduce its proFRAME Base Board 3.1 PXIe Targeting Aerospace, Automotive, and Railway Test Applications at embedded world Germany
Image Credit: Solectrix

Fürth, Germany. Solectrix will introduce its proFRAME Base Board 3.1 PXIe for the PXI Express standard at this year’s embedded world in Germany. The solution is a 3U module using the PXI Express Gen 3 x8 bus with support for streamlined integration into National Instruments’ LabVIEW platform into current systems.

The proFRAME Base Board 3.1 PXIe delivers swappable proFRAME interface adapters to PXIe-based measuring and automation systems, permitting the connection of a wide array of automotive, industrial, and medical cameras, displays, and ECUs. Ideal applications include production and machine supervision along with industrial testing applications in the aerospace, automotive, or railway fields.

Each PXIe module offers two slots for proFRAME interface adapters for up to eight video streams. Supported transmission standards include GMSL, FPD-Link, ASA Motion Link, A-PHY, HDMI, GVIF3, and CSI-2. Precise customer adapters can be made available upon request.

Solectrix CEO Jürgen Steinert said, "Our proFRAME has been successfully deployed in a multitude of testing systems worldwide for many years. With the PXIe form factor, we offer our customers the opportunity to leverage all the strengths of proFRAME in PXIe-based systems as well.”

For more information, visit solectrix.de/products/proframe.

Learn about all the latest news and articles about embedded world.

Secure your free ticket, click here.

Exhibiting at embedded world?  Download our Marketer's Guide to embedded world.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

More from Chad