ADLINK, AI, and the Edge

By Chad Cox

Production Editor

Embedded Computing Design

June 06, 2023

News

ADLINK, AI, and the Edge
Image Credit: ADLINK

ADLINK Technology Inc. released its new MVP Series fanless modular computers, the MVP-5200 Compact Modular Industrial Computers and MVP-6200 Expandable Modular Industrial Computers for 12/13th Gen Intel Core i9/i7/i5/i3 and Celeron processors. Up to 65W are supported by the Intel R680E chipset which can couple with GPU cards for AI inference at the edge.

The MVP-5200/MVP-6200 series is expandable and supports up to 4 PCI/PCIe slots allowing faster movement through GPUs, accelerators, and other expansion cards. Additional extensions include one M.2 2230 A+E-key for Wi-Fi and 5G modules, one 3042/3052 B-key slot, and one M.2 2280 M-key for additional storage.

I/O options

  • 2 DisplayPorts
  • 2 HDMI
  • 6 COM ports
  • 6 USB ports
  • 8-channel digital I/O
  • Three 2.5Gb LAN interfaces
  • 6 SMA antennas connectors which includes four for 5G and two for Wi-Fi

Additionally, the MVP-5200 and MVP-6200 series are scalable with ADLINK AFM (Adaptive Function Module) slot.

For more information, visit  adlinktech.com and adlinktech.com/en/Industrial_PCs__Fanless_Embedded_PCs.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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