Technology - AI & Machine Learning - AI Logic Devices & Workload Acceleration
AI & Machine Learning - AI Logic Devices & Workload Acceleration
Registration Now Open: AI, Robotics, and Data Centers Take Center Stage at COMPUTEX 2025
April 10, 2025
Registration for COMPUTEX 2025 Keynote is now open. The exhibition will take place from May 20th to 23rd at the Taipei Nangang Exhibition Center Halls 1 and 2. A day before the show, on May 19th, the COMPUTEX Keynote will take place, highlighting NVIDIA, Qualcomm, Hon Hai Technology Group (Foxconn), MediaTek, and NXP introducing the next generation of industrial developments.
AI & Machine Learning - AI Logic Devices & Workload Acceleration
Next-Gen Edge AI: DFI Introduces Rugged, Compact, and Medical-Focused AI Systems
April 7, 2025
Taipei, Taiwan. DFI launched new Edge AI systems including the EC600 series with AI module expansion, the compact and fanless EC700 series, and the MPC350-RPS medical Edge AI server, designed for medical AI computing and processing. The solutions are developed to guarantee real-time computing, stable deployment, and enhanced data security.
AI & Machine Learning - AI Logic Devices & Workload Acceleration
Tria Unlocks AI and IoT Potential with Qualcomm-Powered SMARC Modules
March 28, 2025
As edge computing continues to transform with AI in the forefront, having a powerful and energy-efficient module is essential for next-generation applications. Tria's MSC SM2S-QCS6490 SMARC 2.1.1 and MSC SM2S-QCS5430 SMARC 2.1.1 modules are built with Qualcomm technology, delivering high-performance processing, AI acceleration, and extensive connectivity options. Whether for IoT, AI-driven automation, or real-time data processing, these modules are designed to handle the most demanding workloads efficiently.
AI Logic Devices & Workload Acceleration
Lantronix and Teledyne FLIR Deliver Cutting-Edge AI Vision with Advanced Image Processing
March 26, 2025
Analog & Power
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The BMR316 Series from Flex Power Modules
March 27, 2025
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Samtec Halo Optical Transceivers to Pave Way for High Performance
March 26, 2025
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Flex Power Modules Unveiled Advanced AI-Optimized Power Solutions at embedded world 2025
March 17, 2025
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embedded world Product Showcase: AMD’s Spartan UltraScale+ FPGA
March 11, 2025
Debug & Test
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Ignion's Oxion 2.0 Enhances RF Design with Real-Time AI Feedback and Expert Guidance
March 19, 2025
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The Road to embedded world: Linaro’s ONELab Enhances Cloud-Native Edge Readiness
February 19, 2025
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Experience UDE 2025 for the First Time at embedded world 2025: Seamless Debugging and Trace Capabilities
February 12, 2025
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The Road to embedded world: 4tlas to Present its Fuze Collection
February 10, 2025
Industrial
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Wincomm Releases WMP-109 Panel PC with TPM 2.0 and UL/EN 60601-1 Certification Option
April 14, 2025
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MicroBin Corporation: mbXDVK
April 11, 2025
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Cincoze Highlights GPU, DIN-RAIL, and Rugged PCs at Automate 2025
April 11, 2025
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Registration Now Open: AI, Robotics, and Data Centers Take Center Stage at COMPUTEX 2025
April 10, 2025
Networking & 5G
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Embedded Executive: Yes, You Can Do This With Bluetooth | Blecon
March 26, 2025
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Bluetooth: New Specifications and New Capabilities
March 18, 2025
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Embedded Executive: The Evolution of a Wireless Standard, LoRa Alliance
February 05, 2025
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Satellite Connectivity for Vehicles: RN941Y Module Brings Reliable Communication to Remote Areas
January 10, 2025