Vecow and Intel Take AI to the Next Level
May 28, 2024
News
Vecow Co., Ltd. introduced its TGS-1000 Series, a stackable AI PC leveraging a CPU, GPU, and NPU within a single processor. The series supports edge AI applications including AI-accelerated processing, AI-assisted video conferencing, AI-ready immersive gameplay, and 4K streaming. Powered by Intel Core Ultra 7 165H/Ultra 5 135H processor and equipped with robust NPUs (neural processing units), the TGS-1000 Series is ideal for inferencing tasks required by AI.
The innovative NPU/GPU combination supports up to 64GB of DDR5 memory with interfaces including USB, isolated DIO, COM, LAN, and one layer of MXM docking. The embedded Intel Arc GPU promotes high performance immersive experiences with progressive computer vision solutions while reducing the need for entry-level discrete accelerators. Additional support includes up to five 4K displays through HDMI 2.1 and DisplayPort 1.4 and offers high-speed connectivity with one 2.5G LAN and three USB 3.0 ports (two Type-A and one Type-C).
“Vecow is thrilled to introduce our newest AI offering to the market,” stated Judy Hu, Product Manager, Embedded Systems & Platform Division at Vecow. “In collaboration with Intel, Vecow presents cutting-edge TGS-1000 Series, featuring the built-in NPU Intel® Core™ Ultra processor. Alongside the TGS-1000, Vecow has launched the SPC-9000 industrial AI PC and EMBC-7000 3.5” SBC, which also both utilize the same Intel® Core™ Ultra processor. We eagerly anticipate delivering this transformative technology to our customers, ushering in new AI capabilities for all.”
TGS-1000
- 1 2.5G LAN
- 2 USB 3.2 Gen 2
- 1 USB 3.2 Gen 2x2 Type-C
- 2 HDMI 2.1
- 1 DP
- DC 12V to 24V
TGS-1500
- 1 2.5G LAN
- 2 USB 3.2 Gen 2
- 1 USB 3.2 Gen 2x2 Type-C
- 2 HDMI 2.1
- 3 DP
- MXM supported
- DC 24V
For more information, visit vecow.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
