Infineon Technologies is addressing advanced power management design with the Source Down industry standard packaging concept. The first power MOSFETs launched in this new package is the OptiMOS TM 25

Q1 FY 2020: revenue decline as predicted, Segment Result Margin developed positively, cost-reduction measures taking effect, outlook for 2020 fiscal year confirmed.

The higher power density enables a significantly smaller footprint than conventional package technologies.

Highly-integrated processors are needed to support the advanced functionalities a next-generation vehicle must deliver

USB-PD is made possible by the universal USB-C connector, and the next development stage will be permanently installed USB-PD wall outlets.

The REAL3 single-chip solution measures 4.4 x 5.1 mm, and offers high-resolution data with low power consumption.

The power modules feature a maximum allowed overload junction temperature of 175?C.