DATA MODUL AG
Compact Format with Machine Learning Power: DATA MODUL Presents its Latest Board in the Flexible i.MX8M Series - Press Release
October 27, 2022Munich, 20th October 2022 DATA MODUL is expanding the product line of its modular embedded board family and, based on the successful i.MX8M processor series, presents the new i.MX8MPlus, a new and particularly powerful single board computer (SBC) that among other things is ideally suited for a wide range of AI applications.
Candera, next system, and DATA MODUL to Present Innovative Haptic User Interface at embedded world 2021 - Press Release
March 02, 2021The new haptic HMI solution will be presented the first time at Embedded World 2021 at the virtual booth of Candera.
DATA MODUL Presents a New 31.5” Reflective Display for State-of-the-Art IoT Applications - Press Release
January 26, 2021Munich, 26th January 2021. DATA MODUL presents a new reflective display, which is available for the first time in a 31.5” format. It is unique in this size category. Thanks to its low power consumption and excellent readability, particularly under direct sunlight, the new FHD reflective display is perfect for applications in outdoor areas, for example at POS, in the field of digital signage, at bus stops, train stations and in vending machines.
DATA MODUL Introduces New Touch Controller Board Solutions for Small and Medium-sized Diagonals - News
June 30, 2020DATA MODUL is expanding its existing controller board range with two new controller boards for the small and medium diagonal range.
DATA MODUL Expands its Supplier Portfolio in the Display Sector - Press Release
March 03, 2020DATA MODUL continues to place an emphasis on growth and is expanding its supplier portfolio in the Display sector with manufacturers BOE, Evervision and Hannstar.
DATA MODUL presents ultra-flat 10.1 inch Panel PC - Product
September 04, 2019DATA MODUL expands its portfolio of Panel PC solutions and, with a depth of only 31.7mm, presents a new, ultra-flat Slim Panel PC.
New bonding technology for high-volume projects: DATA MODUL is a pioneer of hybrid bonding - Press Release
July 26, 2019DATA MODUL is extending its offer of bonding technologies with an additional process: hybrid bonding.