Ken Briodagh Interviews Austen Lu with Adlink

Ken Briodagh Interviews Austen Lu with Adlink at embedded world 2025

Today’s growing industrial environments and workflows benefit from rugged, reliable, and flexible solutions tailored to meet various interactive and touch-enabled needs.

ADLINK Technology Inc. will showcase its latest advancements in Hall 3, Booth 147 at embedded world 2025 where its motto will be "Greener Tech, Smarter Edge AI" promoting the company’s dedication to sustainability, intelligent Edge, AI, and Smart Manufacturing. ADLINK will highlight its solutions designed to reduce energy consumption and optimize operational efficiency.

AI applications for computing at the Edge are at the peak of excitement and interest across every vertical, and enterprises from the industrial to the consumer are looking for ways to incorporate the power of AI.

Product Description:

The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP®️ i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.

The OSM-IMX93 module supports LVDS and DSI graphics output, 2x GbE (1 TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and provides 15-year product availability.

Boasting the highest safety standards with a separate security island and available with rugged operating temperature options (-40°C to 85°C), the OSM-IMX93 is your ideal solution for various edge AI applications.

In the dynamic landscape of modern manufacturing, Industry 4.0 has ushered in a wave of technological innovations, making AI integral to automating and refining inspection procedures.