New Computer-On-Module (COM) High-Performance Computing (HPC) specification targets the increasing server-level requirements of high-end computing applications on the edge.

As demand for contact lenses grows, automating inspection processes is critical for manufacturers under pressure to increase throughput.

Now that neural nets are the algorithm of choice, AI development frameworks are maturing & first-gen AI processors are hitting the market, we face a stark realization: We have to deploy these things!

The Titan-AL is able to withstand high pressure, hot water cleaning, as it sits within a 316L (V4A) stainless steel housing. It is also resistant to oxidization and other chemical reactions.

ADLINK released the cExpress-TL, its newest generation COM Express Type 6 module. The module is based on the 11th Gen Intel Core i7/i5/i3 and Celeron processor.

ADLINK's AIOMs (AI-on-Modules) will allow developers of AI-enabled embedded systems to design and deploy future-proof cost-effective products quickly and efficiently.

While maker boards like Arduino and Raspberry Pi are great because of their ultra-low cost, they are, well, cheap. That's where I-Pi comes in. It's a SMARC COM, carrier and Hardware-Attached Top.