Winbond announced that the company's TrustME W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C Ready certifications from SGS Brightsight and SGS-TÜV Saar GmbH, respectively.

Flash optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile, and IoT SoCs

Winbond Electronics and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.

The Internet of things (IoT) is driving new capabilities that are transforming how we live, work, and play.

Winbond, in partnership with Nuvoton and Qinglianyun, released a fully integrated reference design for secure OTA firmware updating of IoT devices.

What do you get when you cross high-bandwidth memory with artificial intelligence (AI)?

Winbond Electronics announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.