During COMPUTEX, Fibocom launched a series of on-device AI solutions leveraging the Qualcomm QCS8550 and QCM6490 processors. The platform was developed to support compute-intensive application developments such as robotics, automated vehicles, video collaborations, and smart retailing to promote the enhancement of industrial digitalization and intelligent transformation.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the Wired & Wireless Connectivity (Including IoT & Industrial) category:

Powered by Qualcomm Technologies' premium-tier SoC (System-on-Chip) QCS8250, the module is designed to meet the requirements of high-end AIoT scenarios such as HD video conferences, HD livestreaming, cloud gaming, edge computing, robotics, drones, AR/VR, and so on.

Fibocom announced a collaboration with Aetina Corporation during Embedded World 2022. The joint effort aims to bring high-speed, ultra-reliable and low-latency 5G capacities, enabled by Fibocom’s 5G R16-compliant module FM160-EAU, to Aetina’s AN810-XNX AI edge computing platform, empowering robotics, UAV, industrial IoT, smart healthcare and more.

Fibocom announced its FG150-AE and FM150-AE 5G modules have completed the Deutsche Telekom AG certification.

Fibocom 5G modules FG150-AE and FM150-AE has successfully completed the Deutsche Telekom AG certification, becoming the world's first certified 5G modules at Deutsche Telekom. 

The LU800 combines multi-camera and superior video/audio capabilities with mission-critical transmission in a native 5G unit.