Embedded Computing Design

Patent pending, AnCyR (Anomaly Detection and Cyber-Resilience) host-based software anomaly detection technology provides a real-time front line of defense for embedded connected devices. Based on five years of research at the University of Arizona with support from the National Science Foundation, AnCyR combines statistical, probabilistic, and machine learning algorithms to accurately detect attacks with best-in-class false positives, latency, and overhead.

Cybellum is where teams do product security for mission-critical devices. With an extensive platform to match the needs of specific industries and the individual needs of their products, managers and their teams can rely on dashboards, vulnerability updates, SBOM management, and automating compliance report generation.

Emproof Nyx is 3 orders of magnitude smaller than existing solutions, making it the ideal solution for embedded devices based on ARM, Intel and RISC-V ISAs. No access to source code is needed as the transformational software acts like a post compilation step and just requires access to binary code or libraries, which also means that it works with any build processes and all existing toolchains.

Exein Runtime is a cutting-edge runtime threat detection and response solution (XDR) for Linux and RTOS-based IoT systems. It defends IoT devices against all types of cyber threats and facilitates real-time detection and response to known and unknown attacks.

Exein Analyzer is a powerful security platform that helps organizations identify and address cybersecurity threats in their IoT devices. By integrating with asset identification tools, Exein Analyzer makes it easy to scan the security of your entire IoT fleet.

OPTIGA™ TPM SLB 9673 is a ready-to-use TPM optimized for embedded systems featuring I2C interface and a PQC-protected firmware update mechanism. It is the latest addition to Infineon´s OPTIGA™ TPM family targeted at connected devices that require enhanced security features.

Taking device security to the next level, Digi ConnectCore® Security Services are a collection of advanced services and tools that ensure the security of products during their entire lifecycle — solving the challenge of keeping products secure after release. ConnectCore Security Services include the analysis and monitoring of a custom software bill of material (SBOM) and binary image running on Digi ConnectCore SOMs for security risks and vulnerabilities.

The embedded world exhibition and conference is back and as always, so are our Best in Show Awards. Below are the nominees for the best products of 2023, judged by the Embedded Computing Design staff. Nominees are split into technology categories and judged based on a 15-point rubric that considers solutions’ Design Excellence (5 points), Relative Performance (5 points), and Market Impact/Disruption (5 points). 

With up to 1TB capacity, the BIWIN PCIe Gen4 BGA SSD EP400 comes with the high-speed PCIe 4.0 x 2 to deliver up to 3500 MB/s read and 3300 MB/s write — with dimensions of just 11.5 mm (L) x 13 (W) mm. The storage solution is known for great performance, large capacities, smaller size, lower power consumption, and lower Total Cost of Ownership (TCO) — all of which contribute to a better experience with mobile applications.

The EM064LX is the highest performing persistent memory in the industry. It reads and writes at 400 Megabytes per second over the eXpanded SPI interface, with byte level addressability. With a capacity of 64 Megabits, it has over 4X the capacity of prior serial non-volatile memories.

The SiWx917 SoC is ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. The SiWx917 is a single-chip solution that is Matter-ready, includes an integrated applications processor, and offers industry-leading energy efficiency, making it ideal for battery-powered or energy-efficient IoT devices with always-on cloud connectivity. The SiWx917 supports OFDMA, MU-MIMO, BSS coloring, and other features that enable higher bandwidth and improved network efficiency in crowded environments, which allows for faster, more stable network coverage. 

With dimensions of 2.3 x 2.6 mm, the EFR32xG27 Wireless Gecko family of SoCs is the smallest, low power SoC that enables secure, energy-friendly multiprotocol wireless networking for IoT devices such as wearables and portable medical devices. xG27 features 2/3rd higher output power for Bluetooth LE on 1/3rd of footprint compared to its predecessor, Silicon Labs xG22. The integrated DCDC Boost on xG27 allows IoT device makers to address wide voltage range, enabling the use of single cell alkaline and button cells. The integrated Coulomb Counter enables accurate battery level monitoring to avoid depletion during use of critical health applications. 

The Digi XBee® 3 Global Cellular module is a compact, programmable, reliable solution with BLE and end-device carrier certifications for developing secure wireless devices with worldwide connectivity and global positioning. Options include LTE-M/NB-IoT with connectivity for low-power applications like asset tracking and smart sensors, and Cat 1 for increased throughput. This complete solution includes MicroPython programming resources, a tool suite and a subscription to Digi Remote Manager® with each module for remote software updates and monitoring. XBee Global Cellular smart modems allow customers to use standard cellular protocols in their products for connecting their products to cellular networks worldwide.

GEODE is Diamond’s newest and most innovative and feature-packed rugged computer system. It features COM Express architecture for performance scalability, earlier access to latest generation CPU technology, as well as longer product lifetime. The board-to-board internal construction eliminates most internal cabling to facilitate quicker delivery of custom configurations by elimination of custom case and cabling design and manufacturing. I/O expansion is easy with off the shelf PCIe/104 x1 and x16 I/O modules as well as dual PCIe minicard sockets and M.2 mass storage. IP67 construction and MIL-STD-810 shock/vibration compliance make Geode a perfect fit for the most rugged vehicle applications. Geode integrates a MIL-STD-461/704/1275 compliant power supply with isolation to meet military requirements. Standard configuration includes 11th Gen Core i7 with 64GB RAM, dual Gbe, HDMI, USB3, RS-232/422/485, and GPIO. 

Introducing Polaris - our rugged embedded system powered by NVIDIA Jetson Orin NX with advanced AI and powerful vision capabilities. Polaris operates in harsh environments with an IP67 rating and is ideal for robotics, smart cities, and other rugged use-cases. Its powerful vision capabilities enable object detection, tracking, and recognition for advanced navigation and control of unmanned vehicles and machines. Additionally, it can monitor traffic patterns, pedestrian activity, and environmental conditions for real-time analysis and optimization of city infrastructure and public safety. Polaris is a game-changer, providing the perfect platform for advanced automation, analysis, and vision capabilities    

 AIB-SO21/31 or AIB-SN31/41 is a small-sized embedded computer that supports the latest NVIDIA Jetson system-on-modules (two model names, one same carrier board that supports either an Orin Nano or an Orin NX: AIB-SO21/31 is built with an Orin Nano SoM; AIB-SN31/41 is built with an Orin NX SoM). The carrier board features two 4-Lane MIPI CSI-2, 22 pin FPC Connector, one RJ-45 GbE port, two USB 3.2 Gen2 Type A ports, one USB Type-C port, one M.2 M-Key, and one M.2 E-Key. 

The 12th Gen Intel Core processor-powered SI-624-AI industrial AI computer supports expansion with NVIDIA Ampere Architecture MXM GPU cards (Type A/B form factor, up to 115W), leveraging the powerful parallel computing capabilities of NVIDIA GPUs to provide multiplexed and advanced image processing. The compact system meets the needs of high-performance applications in space-constrained environments and can solve problems in harsh environments. Designed for AIoT applications in automation, smart retail, or education, it enables institutions to connect and communicate with their audiences by reliably delivering high-quality live video or AI analytics content for use in AI fields.     

The AGS103T is a compact IoT gateway edge computing system powered by Intel Atom x6000E series processors. The energy-efficient platform is suitable for embedded applications in factory automation, IoT gateway, edge computing, and automatic control systems. The rugged AGS103T supports the 5G module and offers advanced features such as an extended operating temperature range of -20°C to 70°C, three 2.5 Gigabit Ethernet ports for fast wired connectivity and multi-protocol communications, and over/under/reverse voltage protection. With an option for additional 2.5" drive bays, it supports DIN-rail and wall-mount installation, and onboard TPM 2.0 hardware-based security ensures platform integrity

The INA1600 is an uCPE/SD-WAN appliance powered by the AMD Ryzen Embedded R1000/V1000 processor. The entry-level INA1600 supports WiFi 6 and 5G LTE Cat20 connectivity and is FlexiWAN certified, making it easy for system integrators to deploy enterprise networks leveraging universal customer premises equipment (uCPE). The INA1600 features up to four 1G copper ports and optional two RJ45/fiber combo ports. It has two WAN ports for secure Internet connectivity and VPN support in SD-WANs, replacing traditional MPLS private lines in enterprises. The desktop appliance supports LTE/5G wireless communication module with dual SIM cards. 

DFI’s PCSF51 is the next-generation 1.8” single board computer that boosts performance to a new level .Featuring AMD Ryzen™ Embedded R2000 Series SoCs, this extremely compact credit card size SBC comes in an 84mm x 55 mm form factor with optimized power and sharp graphics. The all-new AMD Ryzen™ R2000 doubles the max CPU core count, providing up to 4U/8T, 8x GPU CU computing power.PCSF51 offers a wide range of scalability through various expansion slots, including SATA 3.0, USB 3.1, and M.2 expansion. It also supports up to 16 PCIe Gen3 connectivity to accommodate a broad range of I/O requirements