Embedded Computing Design

The rapid increase of AI (artificial intelligence) related workloads in data centers and edge computing demand new compute designs. Data center system designers are challenged to provide higher-speed devices within reduced design cycles. New PCIe devices will need to keep up with Ethernet network interfaces in data centers and the emergence of CXL (compute express link).

BrainChip Holdings Ltd, a commercial producer of ultra-low power neuromorphic AI chips and IP, and SiFive, Inc., the founder and leader of RISC-V computing, have combined their respective technologies to offer chip designers optimized AI/ML compute at the edge.

As the volume of data transferred via internet and the number of data centers across the world increase, proper testing of Ethernet cable assemblies becomes crucial. As direct attach copper (DAC) cables are the most economical solution for short data connections, they are widely used in high-speed networks and data centers. Installations include a huge number of these DAC cables, and their performance is vital for the whole system.

As 5G networks continue to expand around the world, mobile network operators are adding 32T32R radios to increase their massive MIMO coverage beyond ultra-dense urban areas into less dense urban and suburban areas. By combining 32 antennas instead of 64, coverage can be maintained more cost effectively while maintaining the high-end 5G experience enabled by massive MIMO.

Perle Systems, a provider of networking hardware, announced the IRG7440 5G Router & Gateway that is certified for international operation.This 5G Router does not require an annual subscription or license fees to access features, maintain operation, or download software updates. All features and functionality are included in the base price of the product.

Soracom, Inc., a global provider of advanced IoT connectivity, has entered an agreement with Orange Wholesale France to expand its network for IoT connectivity around the world. 

The VDX3-6755 family of boards implement the DM&P dual-core Vortex86 DX3 processor with the rugged PC/104 form factor to promote a single board computer that natively supports full ISA and is a replacement option for many legacy x86 architecture CPU boards facing EOL.

Connected device observability and diagnostics platform provider Memfault was selected to participate in the 5G Open Innovation Lab (5GOIL or 5G OI Lab). Memfault joins 11 other multistage startups participating in the fifth batch of the 12-week program.

Siemens Digital Industries Software announced that its Analog FastSPICE (AFS) platform is now certified for United Microelectronics Corporation’s (UMC) 28nm high-performance, low-power process technology.

Variscite, a System-on-Module designer and manufacturer, launched a new production line that increased in-house manufacturing capabilities at its production and warehouse facilities to help bypass the component crisis due to the impact of COVID and supply chain challenges.

Semtech Corporation, a supplier of high-performance analog and mixed-signal semiconductors and advanced algorithms, announced March 2022 production of its Tri-Edge™ clock and data recovery (CDR) with an integrated DML driver to enable emerging 50Gbps PAM4 5G front haul deployments, the GN2255.

Ambiq® introduced an expanded Apollo4 SoC portfolio, including the latest Apollo4 Plus and Apollo4 Blue Plus with Bluetooth Low Energy connectivity with enhanced graphics display capabilities and more robust security features to protect power-constrained IoT endpoint devices without compromising power efficiency.

Learn how MistyWest, a sustainability-centric design engineering firm out of Vancouver, British Columbia helped the World Wildlife Fund transform the state of the art in wild polar bear tracking.

Industry 4.0 has been in the works for more than a decade but is finally reaching critical mass. As OT professionals prepare to safely and securely ramp up industrial digitization initiatives, there are a range of new, probably unfamiliar technologies they must become acquainted with to have a shot at success.

Here are the top three.

Wi-Fi 6 is on the cusp of mass global adoption and is on track to displace Wi-Fi 5 (i.e., IEEE 802.11ac) by 2023 as the dominant form of consumer Wi-Fi. ABI Research forecasts more than 1 billion consumer, enterprise and carrier Wi-Fi access points to ship between 2022 and 2026, the vast majority of which will be based on the Wi-Fi 6/6E standards.

Together, the two companies will build 5G-ready solutions to expand the diversity of commercially available O-RUs and facilitate the growth of Open RAN networks. As a part of this collaboration, STL and Analog Devices will work closely with other ecosystem providers, including power amplifier vendors, to expand the range of STL's Garuda O-RU indoor small cell offerings.

Renesas Electronics Corporation's RZ/Five employs the Andes AX45MP, based on the RISC-V CPU instruction set architecture (ISA). The RZ/Five augments Renesas’ previously available Arm® CPU core-based MPUs, expanding customer options and providing more flexibility in the product development process.

Without plastics we wouldn’t have computers, televisions, smartphones, or even electronic components that are manufactured using resins of the material. And that’s just the technology sector.

The telecommunications industry’s growing open ecosystem gives CSPs more choice in their technologies and partners as they modernize to cloud-native networks. CSPs need the various technologies of this open ecosystem to work together to offer differentiated edge services and reduce costs.

Telit announced two additional modules based on the Qualcomm 9207 LTE IoT modem — the LE910C1-WWX and LE910C4-WWX — for its LTE IoT portfolio to enable single-SKU global deployments. The new LTE Cat1 and Cat4 modules complete the Telit LE910C1 and LE910C4 families.