Embedded Computing Design

The German manufacturer Wachendorff Automation is expanding its product portfolio of length measuring systems.

The software allows users to remotely connect with their Mitsubishi Electric CNC machine to manually change or automate offsets.

CONTA-CLIP expands its terminal block range featuring push-in connection for 2.5 mm² cross sections, adding the new PIKD three-level initiator terminals and multi-wire terminals.

TDK Corporation developed the TCM0403M Series of miniaturized thin-film common-mode filters for mobile devices. The 0403 case size (0.45 x 0.3 x 0.23 mm) is 58% smaller and 56% lighter than previous products. With its high common-mode attenuation characteristic, these products reduce intruding noise and improve wireless signal reception sensitivity. The common mode attenuation at 2.4 GHz is 21 dB, and 28 dB at 5.0 GHz, with a maximum permissible current of 50 mA.

STMicroelectronics’ STDRIVEG600 half-bridge gate driver has high current output and 45ns propagation delay, closely matched between high-side and low-side outputs, to handle high-frequency switching of GaN enhancement-mode FETs.

The Movandi approach is based on patented 5G millimeter-wave chipsets, RF power amplifiers, MIMO (Multiple Input Multiple Output) antennas, BeamXR smart repeater modules, and BeamX algorithms and software. It provides mesh networking capability with redundant and dynamic routing and will soon provide control via cloud-based data centers to balance and optimize network routing based on traffic and quality of connectivity. This reduces the required number of gNBs through load-balancing traffic across networks to provide continuous connectivity, even in moving vehicles.

NORD provides configurable gear units, electric motors, and variable frequency drives for precise control of conveyor systems, sortation devices, and more.

Epishine's organic solar cells are small, thin, flexible, and printed on recyclable plastic. The cells can be easily integrated into any low power electronic equipment where they convert ambient indoor light into electricity. New product designers can replace batteries in wireless sensors and similar devices with the organic solar cells, reducing the environmental impact of battery waste and saving battery replacement costs.

AAEON, a manufacturer of network platforms and edge computing solutions, has partnered with the National Taiwan University of Science and Technology (NTUST) and Chunghwa Telecom to help create the 5G Smart Manufacturing Technology Research and Validation Site (5G SMT RVS). This research and testing site is designed to operate and evaluate Multi-access Edge Computing (MEC) server implementation, focusing on developing and refining Smart Manufacturing applications which utilize 5G cellular networks.

The Global Digital Twin Market is valued at US $3.07 billion in 2020 and is expected to reach US $49.1 billion by 2027, growing at a CAGR of approximately 45.5%. As manufacturing activities are becoming gradually more digital, the digital twin is now within everyone's reach.

Rollon, a manufacturer of linear motion guides, actuators, and systems, has acquired Intelligent Machine Solutions, Inc. (iMS), a Michigan-based designer and manufacturer of standard and custom machinery for the automation industry.

Optical Gaging Products (OGP®), a manufacturer of precision multisensor metrology systems for industrial quality control, announced a technological breakthrough in value-class video comparator systems: The Automatic Three-Position Lens Changer, available on c-vision™ Lite Video Contour Projectors®.

Lanner Electronics and ADVA announced that Lanner’s NCA-4025 is now verified as an Intel Select Solution for uCPE with ADVA Ensemble Connector, giving communication service providers (CSPs) and enterprises a route to virtualization at the network edge.

Utility meters need to work without interruption and often under adverse conditions. From full load to light load, through line surges, or even when being tampered with, meters require rugged and efficient power supplies to deliver power without fail.

Coordinated by Infineon Technologies AG, the research project "Design methods and hardware/software co-verification for the unique identifiability of electronic components" (VE-VIDES) has begun operations.

Vishay Intertechnology, Inc. released a bidirectional asymmetrical (BiAs) single-line ESD protection diode in the compact new DFN1006-2A package. Saving space over solutions in SOT packages, the Vishay Semiconductors VCUT0714BHD1 offers low capacitance and leakage current for the protection of high-speed data lines against transient voltage signals.

Power saving and heat reduction benefits make DDR5 SODIMM suitable for manufacturers of high-performance embedded systems and industrial computers and accelerate the development and commercialization of next-generation computing. It supports Intel's 12th-generation Alder Lake mobile processors and is expected to enter mass production in 2022.

I²C and SPI are two of the most widely used serial communication buses for embedded systems, and each comes with its own set of advantages and disadvantages. SPI is the faster protocol, but that comes at the expense of higher pricing and limited scalability.

Base interoperability at the component level facilitates device interoperability across various applications and profiles, including IEEE/IEC 60802 for industrial and IEEE 802.1BA for ProAV, as well as future profiles that are in development.

AT&T and Kigen are working together to help customers streamline their supply chains and reduce the time to market for enterprises who want to leverage SIM, embedded SIM (eSIM), and integrated SIM (iSIM) secured connectivity deep in their IoT devices.