Micross Will Present Microelectronic Products & Services at Electronica 2018
November 12, 2018
Press Release
Micross to Showcase Hi-Rel Microelectronic Products & Services at Electronica 2018 in Munich.
Micross will be at Electronica 2018, November 13-16, in Munich, Germany in Hall C5, Booth 436. Products on display will include:
- Bare Die & Wafer Processing
Broadest Access to Bare Die 30+ Manufacturers
- Advanced Interconnect Technology
Wafer Bumping / Wafer-Level Packaging
- Packaging & Assembly
Optoelectronic & Silicon Photonics Assembly
- Component Modification
BGA Reballing / Column Grid Array (CGA)
- Advanced Testing Services: Electrical & Environmental Test
FPGA, ASIC, RF Test / Life Test & Burn-in
- Hi-Rel Products
SMD/5962 & Extended Temperature Plastic
For additional information, visit http://www.micross.com.
