Lower power, higher performance in an embedded system. Really.

By Rich Nass

Contributing Editor

Embedded Computing Design

November 18, 2014

Lower power, higher performance in an embedded system. Really.

I bet you haven't heard this one before - one of the silicon vendors has an IC that reduces space, power, and hardware requirements in an embedded sys...

I bet you haven’t heard this one before – one of the silicon vendors has an IC that reduces space, power, and hardware requirements in an embedded system. You have heard it before? Yeah, me too. So it generally takes a lot of convincing for me to believe those statements.

In this case, it may actually be true. PLX Technology has developed its ExpressFabric device, which the company says is already in use with some beta customers. How it works is that it adds an optical technology to places that have traditionally used copper. It takes advantage of PCIe inside the rack, rather than just externally. To me, that seems like a no-brainer and I’m surprised no one had already come up with the idea (or at least brought such a product to market).

The end result is bringing PCIe’s raw performance to the board level. In this configuration, the only time you’d need to convert to a different protocol is when your data leaves the rack. In other words, you’re using PCIe exclusively inside the rack, thereby eliminating any bridge devices. Hence, the lower cost and potentially higher performance.

To ensure compatibility, the technology can co-exist with other interconnects, like InfiniBand and Ethernet. So you still get to use your interconnect of choice if you so desire. If speed is a priority, I suggest you give this one a look.

Rich Nass, Embedded Computing Brand Director

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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