VIA to Debut the VIA SOM-9X20 Module Powered by a Qualcomm Snapdragon Embedded Platform @ IOTHINGS Rome 2017

November 10, 2017

VIA to Debut the VIA SOM-9X20 Module Powered by a Qualcomm Snapdragon Embedded Platform @ IOTHINGS Rome 2017

Full range of highly-customizable VIA Smart IoT platforms that fast-track the development of commercial-grade IoT deployments on display

 

Taipei, Taiwan, November 09, 2017 – VIA Technologies, Inc., today announced that the VIA SOM-9X20 module powered by a Qualcomm® Snapdragon™ 820 embedded platform will makes its European debut at the IOTHINGS Rome 2017 conference, being held this November 21-22 in Rome, Italy, at the Centro Congressi Auditorium della Tecnica. 

The VIA SOM-9X20 is an ultra-compact SoM that harnesses the leading-edge performance and low power consumption of the Snapdragon 820 embedded platform to provide a highly-flexible solution for enabling the rapid development of a variety of Enterprise IoT and embedded system applications ranging from human-machine interface (HMI), surveillance, and digital signage to robotics, cameras, and video conferencing.

The rapid proliferation of the IoT is opening up a wealth of opportunities for companies to boost the efficiency of their operations and develop exciting new products and services,“The rapid proliferation of the IoT is opening up a wealth of opportunities for companies to boost the efficiency of their operations and develop exciting new products and services,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “With leading-edge solutions such as the SOM-9X20, we provide enterprises with an unrivaled choice of highly-scalable, ultra-reliable platforms that can be rapidly customized to unlock the full potential of their IoT deployments.”

In addition to the VIA SOM-9X20 module, highlights on display will include a broad spectrum of commercial-grade systems, HMI starter kits, and IoT acceleration platforms that can be rapidly customized for smart transportation and smart city applications.

 

VIA Alegro 100 Smart Home Solution

Designed to serve as the lynchpin within the smart home ecosystem the OCF certified VIA Alegro 100 multiprotocol home gateway router is VIA latest IoT Studio innovation. Supporting all the most popular wireless standards, the VIA Alegro 100 orchestrates cross-protocol communication between a wide range of connected devices, enabling remote monitoring and control of smart environment directly from a smartphone or tablet.

 

VIA AMOS-825 Smart Taxi IoT Acceleration Platform

Already deployed by one of the leading taxi companies in Japan, this platform combines the VIA AMOS-825 system with an LCD monitor to provide a flexible and ultra-rugged solution for enabling applications and services such as navigation, route tracking, driver notifications, passenger pickups, and electronic payments.

 

VIA VAB-630 HMI System Platform

Combining a highly-integrated 3.5” SBC form factor motherboard with an optional 10.1” touch panel screen, the VIA VAB-630 comes with a raft of advanced compute, graphics and video features to ensure optimum performance for interactive multimedia applications in kiosks and signage display systems.

 

VIA SOM-6X50 ARM-based Module

The ultra-compact VIA SOM-6X50 system-on-module, powered by a 1.0GHz VIA Cortex-A9 SoC, delivers the perfect balance of performance and rich multimedia features in a highly-flexible package for a wide range of IoT automation and HMI applications.

Also as part of the Exhibitor’s Forum during IOTHINGS Rome 2017, Giuseppe Amato, Technical Manager & Business Development Europe, VIA Embedded, will be presenting “A Smart Implementation for Internet Of Things” on the 21st of November at 11:30am.

For more information about IOTHINGS Rome 2017, please visit: www.iothingsrome.com/?lang=en

For more information about the VIA SOM-9X20 module, please visit: www.viatech.com/en/boards/modules/som-9×20[...]

For more information about VIA Custom IoT Design Services, please visit: www.viatech.com/en/services/hw-engineering/arm/[...]

 

About VIA Technologies, Inc.

VIA Technologies, Inc is a global leader in the development of highly-integrated embedded platform and system solutions for M2M, IoT, and Smart City applications, ranging from video walls and digital signage to healthcare and industrial automation. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the many world’s leading hi-tech, telecommunications, consumer electronics industry brand names. www.viatech.com

Qualcomm, Snapdragon, Kryo, Adreno, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Qualcomm Spectra is a trademark of Qualcomm Incorporated.

Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Adreno, Qualcomm Hexagon, and Qualcomm Spectra are products of Qualcomm Technologies, Inc.